Relay Eliminates External PCB Traces in Loop-Back Test Applications
Presented as the first device of its type, the Teledyne Relays hermetically sealed LoopBack relay combines the technology of two Teledyne RF300 Series relays and eliminates the need for external PCB traces in loop-back test applications. This innovation results in superior signal integrity and RF performance, while taking minimal board space.
The relay is designed for digital signaling applications with excellent signal integrity up to 12 Gbps data rates. Additionally the relay has the low loss high frequency performance associated with the RF300 Series. The relay construction provides two internal paths: Through and AC Bypass. While the through path provides a loop-back path across high performance contact material the AC Bypass path adds a coupling capacitor across each loop-back path. The in-line capacitors allow designers to remove the footprints for external components by performing AC bypass functions internally.
The typical loop-back ATE application uses the Device Under Test (DUT) to test itself. In this method, the transmitter from the DUT is connected, through a loop back path, to the receiver of the DUT. The double pole design of the relay is perfectly suited for differential signaling, allowing one component to provide, transmit and receive signals and their inversions to the DUT, and through the bypass path.
The relay has a footprint of just 20.45mm x 9.52mm. with a choice of through hole or surface mount capability.
For additional information and a data sheet please go to www.teledyne-europe.com or e-mail firstname.lastname@example.org