Probe Sockets Target Package-on-Package Devices
Tue, 10/25/2011 - 12:07pm
Ironwood Electronics has recently introduced series of high performance BGA socket for high speed probing of the memory chip and processor debugging during the design phase. One such BGA socket is designed for a 1 Gb Mobile DDR2-S4 SDRAM (12 mm x12 mm, 0.5 mm pitch, 168 FBGA Package). The stacked socket can be used to probe a 1 Gb memory device using Agilent's Flex Probe stacked inside the socket. Agilent's probe makes contact with the target PCB through the 0.5mm thick high density elastomer contact. The memory chip sits on top of the probe and makes contact with it through high speed elastomer contact as well. Agilent's probe brings out the signals to oscilloscope/logic analyzer for high speed probing.