LIN Transceivers Offer Smaller Packaging, Wettable Flanks
Wed, 09/07/2011 - 2:15pm
Atmel Corporation announced the availability of two stand-alone LIN (local interconnect network) transceiver ICs in DFN packages. The DFN14 package for the ATA6670 measures 3 mm x 4.5 mm, while the DFN8 package for the ATA6663 measures 3 mm x 3 mm. The ICs are suitable for LIN bus networking applications such as automotive body electronic systems, including door modules, seat control, intelligent sensors or powertrain applications. Since both DFN packages are pin-compatible, customers can use either the single- or the dual-LIN transceiver on the same PCB design without any changes. The LIN DFN packages with wettable flanks make solder joints visible. This feature enables the use of automated optical inspection (AOI) tools during final quality tests at the system manufacturers' production line, which eliminates the need for X-ray inspections. In addition, the wettable flanks enable improved soldering performance for temperature cycling.