Product Releases

Epoxy Preforms Intended For Sealing Subminiature Electronics

Tue, 04/05/2011 - 6:33am
Nano-forms epoxy preformsMulti-Seals Inc. introduces Nano-forms epoxy preforms to provide precision seals on microelectronics. With preforms as small as 0.035" (0.89mm) outside diameter and 0.011" (0.28mm) inside diameter, Nano-forms allow highly repeatable placement of minute amounts of epoxy with precision that is unattainable with traditional dispensing methods. With dimensional tolerances as close as ± 0.0005" (0.013mm) for critical applications, Nano-forms can control epoxy volume to within 0.00002cc for a typical configuration. Exceptional repeatability is further promoted with closely controlled pre-mixed ratios of resin to catalyst.

In addition, Nano-forms are not affected by pot life, so epoxy viscosity is consistent from beginning to end of production batch. This combination of precision and consistency makes Nano-forms ideal for sealing fiber-optics and subminiature switches, capacitors, diodes, LEDs, and other microminiaturized components. Like other Uni-forms epoxy preforms, Nano-forms are pre-shaped, one-part resins that are solid at room temperature. When heated, Nano-forms melt and cure, forming a consistent seal that protects components from dust, moisture, oil, flux, solvents, conformal coatings, and other contaminants. Multiple epoxy systems are available to meet diverse application requirements.



Share this Story

You may login with either your assigned username or your e-mail address.
The password field is case sensitive.