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Epoxy Preforms Intended For Sealing Subminiature Electronics

Tue, 04/05/2011 - 6:33am
Nano-forms epoxy preformsMulti-Seals Inc. introduces Nano-forms epoxy preforms to provide precision seals on microelectronics. With preforms as small as 0.035" (0.89mm) outside diameter and 0.011" (0.28mm) inside diameter, Nano-forms allow highly repeatable placement of minute amounts of epoxy with precision that is unattainable with traditional dispensing methods. With dimensional tolerances as close as ± 0.0005" (0.013mm) for critical applications, Nano-forms can control epoxy volume to within 0.00002cc for a typical configuration. Exceptional repeatability is further promoted with closely controlled pre-mixed ratios of resin to catalyst.

In addition, Nano-forms are not affected by pot life, so epoxy viscosity is consistent from beginning to end of production batch. This combination of precision and consistency makes Nano-forms ideal for sealing fiber-optics and subminiature switches, capacitors, diodes, LEDs, and other microminiaturized components. Like other Uni-forms epoxy preforms, Nano-forms are pre-shaped, one-part resins that are solid at room temperature. When heated, Nano-forms melt and cure, forming a consistent seal that protects components from dust, moisture, oil, flux, solvents, conformal coatings, and other contaminants. Multiple epoxy systems are available to meet diverse application requirements.

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