Texas Instruments introduced a 16-bit, dual channel, 1 GSPS (giga sample per second) digital-to-analog converter (DAC) family. The single and dual-channel DAC family features a low-voltage differential signaling (LVDS) data input port at 1 Gbps, providing up to 400 MHz signal bandwidth.
Presented as the first integration of USB On-the-Go (OTG) and host capability in the ARM Cortex-M3 architecture, Luminary Micro’s Stellaris Microcontrollers also integrate the ARM PrimeCell 32-channel configurable µDMA controller to provide features such as advanced scatter/gather transfer modes. The LM3S3000 USB Series and LM3S5000 CAN+USB devices feature a USB controller that can be configured for USB Host-mode or USB Device-mode
Tektronix announced the availability of the DPO3000 Digital Phosphor Oscilloscopes (DPOs), a portable series of models that provides triggering and decode support for popular serial buses used in embedded design applications. They offer 5M standard record length and use the
CamSemi announced a mixed signal controller to enable the rapid development of simple, low cost, switched mode power supplies (SMPS) for cordless phone and other EMI-sensitive or low power consumer applications. The C2471 device will allow designers to meet the demands of
Targeting execute-in-place (XIP) applications in devices where size, power consumption, and high data rates are important, the 3.0-V SST26VF016 Serial Quad I/O 4-bit multiplexed I/O flash memory is available in an 8-contact WSON (6 mm x 5 mm) or 8-lead SOIC (200 mil) package. Handling up to a 350 Mbit/s sustained burst data rate and 8-, 16-, 32- or 64-Byte burst mode operation, the 16-Mbit device operates at 80-MHz and can erase small block sectors in as little as 25 ms or the entire memory in 50 ms.
Aimed at singlelane external storage applications with less than six feet of cable the eSATA input/output connectors from FCI provide external data backup and protection at speeds up to 3 Gb/s. They operate at both Gen1 and Gen2 speeds so regardless of the implementation the outside of the device enclosure will meet Gen1m specifications when operating at Gen1 speeds and Gen2m specifications when operation at Gen2 speeds.
Using the recently-introduced SUMIT (Stackable Unified Module Interconnect Technology) expansion interface, the Express104 SBC stackable module form factor specification from the Small Form Factor Special Interest Group provides the basis for stackable, I/O-centric, multi-board systems. Processor architecture and chipset independent, the specification describes a 90 mm × 96 mm board
Lambda has expanded its range of point-of-load (POL) DC/DC converters with the iAD Series of 16A non-isolated, single inline package (SIP), thru-hole mounted devices. Featuring a DOSA compatible pin-out, the iAD Series addresses a range of applications including
Elmo Motion Control added the Solo Whistle to its family of servo drives. This ready-to-use integrated device is designed to connect the company's Whistle Servo Drive directly to the application. The solution consists of the Whistle plus a connection interface which either eliminates or reduces
Packaged in an EIA 0603 case, Taiyo Yuden’s BRC1608 series of high-current, wire-wound power inductors are touted as the smallest available, measuring 1.6 mm × 0.8 mm × 0.8 mm. In addition to small size, the eight models offer a DC resistance of 0.06? to 0.55?, inductance of 0.2 µH to 2.2 µH and current; ratings of 0.98A to 0.28A. The footprint of the series facilitates compact DC/DC converters and thinner-profile products
Created to support E Ink's Vizplex-enabled electronic paper displays, the Epson S1D13521B is a jointly-developed display controller IC will bring greater functionality with user interface features such as navigation, drop down/popup menus, responsive cursors, and real-time keyboard entry. The device can perform regional updates and enables the display to perform up to 16 tasks in parallel with support for pen input devices.
Crystek’s CCSO-914X3-1000 1GHz SAW Clock Oscillator (CCSO) is delivered in a 9 mm × 14 mm SMT package. Featuring -142 dBc/Hz phase noise at 10 KHz offset, the device uses FR5 PCB and SAW (surface acoustic wave) crystal technology. It uses a +3.3V supply and generates a true-sinewave with +5 dBm min. output power.
Intended to appeal to designers of embedded systems that require fanless operation, the Qseven single-board computer (SBC) specification created by a consortium including congatec AG and SECO and endorsed by the Small Form-Factor SIG has a maximum power consumption of around 12 W and a novel thermal cooling interface to aid in heat transfer. The specification provides for a 70-mm² footprint and offers two different connector heights, 5.5mm and 7.8mm.
The RoHS-compliant HS and HW, single- and dual-cell supercapacitors from Tecate Industries boast what is presented as the industry’s highest voltages for low ESR pulse supercapacitors. The high temperature electrolyte extends both the operating voltage (from 4.5V to 5.5V), and the operating and storage temperature (from 75°C to 85°C). This higher temperature specification enables them to operate reliably in portable and
Based on the 400,000-gate and 8,000-logic-cell 3S400A FPGA from Xilinx, a development kit from Avnet provides a platform for experimenting and prototyping applications based on the Xilinx Spartan-3A FPGA family. Suitable for exploring general logic designs as well as DSP and MicroBlaze-based embedded processing applications