Fine Pitch Bump Adapters Allow for SMT Adaptation of TSSOP, QFP
Fri, 02/11/2011 - 6:45am
Aries Electronics offers a line of adapters which convert TSSOP, QFP and other fine pitch devices to any other fine-pitch bumped package or routing configuration down to 0.4mm pitch. These Fine Pitch Bump Adapters are mounted to the existing PCB via raised pads up to 0.010" (0.25 mm) on the adapter bottom. The adapters feature pads on the component side designed to accept any device on any pitch (0.5 mm or greater) and easily route the signals for packages including TSSOP, QFP and other fine-pitch devices down to 0.40 mm. In addition to simple circuit correction, other active or passive components can be added to the adapter to facilitate a more complex or custom adaptation via the open space available at the top of the adapter board. This extra available space allows for easy conversion of the original design. The Aries' Fine Pitch Bump Adapter boards are 0.032" (0.813 mm) thick FR4 or Rogers 370 HR, with 1/2 oz. copper traces on both sides.