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Rectifiers enable higher current densities in high-frequency inverters

Thu, 01/20/2011 - 6:30am
Trench MOS Barrier Schottky RectifiersVishay Intertechnology, Inc. today expanded its TMBS Trench MOS Barrier Schottky rectifiers for solar bypass applications with four new 45 V devices offering eSMP surface-mount and axial-leaded package options.

The devices released today are designed to enable higher current densities in low-voltage, high-frequency inverters, and solar cell junction boxes, where they will be used as bypass diodes for photovoltaic solar cell protection.

The 10 A V10P45S and 15 A V15P45S are offered in surface-mount SMPC packages with a typical height of 1.1 mm. Designed for automated placement, the SMPC package meets MSL Level 1.

Axial-leaded rectifiers released today include the 15 A VSB1545 and 20 A VSB2045 in the P600 package. The devices can handle solder dip temperatures to 275 °C for 10 seconds per JESD 22-B106, and feature a maximum junction temperature of + 150 °C.

The TMBS rectifiers combine their high forward surge capability with low forward voltage drops down to 0.30 V to minimize power losses. The devices are compliant to RoHS Directive 2002/95/EC and WEEE 2002/96/EC, and are halogen-free according to the IEC 61249-2-21 definition.

Samples and production quantities of the new 45 V TMBS rectifiers are available now, with lead times of eight weeks for larger orders. Pricing for U.S. delivery begins at $0.80 for SMPC and axial-leaded devices in quantities below 10,000 pieces. Follow TMBS rectifiers at http://twitter.com/VishayIndust.

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