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Synchronous forward MOSFET driver eliminates signal transformer

April 2, 2014 1:41 pm | Linear Technology Corporation | Comments

Linear Technology Corporation (Milpitas, CA) announces the LT8311, a high-efficiency secondary-side MOSFET driver that operates without the need for primary control in an isolated synchronous forward converter. The LT8311’s unique preactive mode eliminates the need for a signal transformer....

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802.11b/g/n Wi-Fi System In Package (SiP) module is presented as world’s smallest, most integrated

April 2, 2014 1:38 pm | eConais, Inc. | Comments

Econais Inc. (San Jose, CA) announced the EC19W01, positioned as the world’s smallest, smartest and most integrated 802.11b/g/n Wi-Fi System In Package (SiP) module. The EC19W01 offers low power drain and features

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Thermal controller designed to operate with thermoelectric modules

April 2, 2014 1:33 pm | Oven Industries, Inc. | Comments

Oven Industries’ (Mechanicsburg, PA) Model 5R7-350/347 is an economical thermal controller especially designed to operate with thermoelectric (Peltier effect) modules. Most of these modules may be operated in either a cooling mode or a heating mode depending on current direction....

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Ethernet switches include integrated PROFINET I/O stack

April 2, 2014 1:18 pm | Harting, Inc. | Comments

HARTING’s (Elgin, IL) two newest, fully managed Ethernet switches — the Ha-VIS mCon 3000 Next Generation — have been optimized for fast deployment in the harshest industrial environments to support today’s increasingly sophisticated network structures....

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Industrial-grade embedded computers feature Intel Multi-Core Atom E3800 processors

April 2, 2014 2:10 am | Winsystems | Comments

WinSystems (Arlington, TX) introduced a line of multi-core Intel Atom E3800 embedded computers designed to operate from -40°C to +85°C. The SBC35-CC405 Series of embedded PCs include onboard USB, Gigabit Ethernet, serial ports, and...

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Development kit streamlines application-specific design process using mini low power MCUs

April 2, 2014 2:04 am | Rohm Semiconductor | Comments

LAPIS Semiconductor Co. Ltd., a ROHM Group Company, (Santa Clara, CA) introduced its LaPi Development Kit for its latest series of Mini Low Power Microcontroller products. The LAPIS Semiconductor LaPi Development Kit helps accelerate the

EBX computer board family adds a dual-core Intel Core i3 and a Celeron-based products

April 2, 2014 1:55 am | Versalogic Corp. | Comments

VersaLogic Corp. (Tualatin, OR) announced the release of two new models in its “Copperhead” line. The new offerings include a dual-core Intel Core i3 product, and a Celeron-based product. The models are positioned to provide both lower cost...

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8-bit MCU family includes intelligent analog and core independent peripherals

April 2, 2014 1:35 am | Microchip Technology Inc. | Comments

Microchip Technology’s (Chandler, AZ) PIC16(L)F170X and PIC16(L)F171X family of 8-bit MCUs combine intelligent analog and core independent peripherals along with cost-effective pricing and the company’s eXtreme Low Power (XLP) technology....

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Insulation resistance tester rated at 15 kV

April 1, 2014 4:31 pm | Comments

Megger (Norristown, Pa) now offers a versatile insulation resistance tester (IRT) rated at 15 kV. The MIT1525 measures motors and generators above 34,500 V and equipment rated above 35 kV. Ideal for applications that use cables, transformers, motors/generators, circuit breakers, and bushings....

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Three-wire, true zero-speed sensor IC incorporates dual Hall-effect elements

April 1, 2014 4:24 pm | Allegro Microsystems, Inc. | Comments

Allegro MicroSystems, LLC (Worcester, MA) introduces a new optimized Hall-effect sensing IC that provides a user-friendly solution for digital ring-magnet sensing or when coupled with a magnet, ferromagnetic target sensing, in three-wire applications....

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Wire-to-board connector system serves thin-screen LED televisions and monitors

April 1, 2014 2:53 pm | Molex Incorporated | Comments

Molex Incorporated (Lisle, IL) introduces its IllumiMate 1.00 and 1.25 mm pitch wire-to-board connector system, offering today’s flat-panel LED television and PC monitor manufacturers more mating styles, voltage ratings, circuit sizes and locking types than any similar connector system....

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Current-to-pressure transmitter features removable electronics and switch-selectable output

April 1, 2014 2:15 pm | Moore Industries | Comments

Moore Industries (North Hills, CA) has released a new version of its IPH2/IPX2 Current-to-Pressure (I/P) Transmitter. Along with updated certifications, the IPH2/IPX2 features 22 direct and reverse output ranges, with switch-selectable reverse output standard...

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Step-down DC/DC converter includes 60V transient protection

April 1, 2014 2:04 pm | Linear Technology Corporation | Comments

Linear Technology Corporation (Milpitas, CA) announces the LT3667, a 400mA, 40V step-down switching regulator with dual LDO outputs packaged in a 3mm x 5mm QFN or MSOP-16E. The LT3667 offers a highly compact, triple output solution for automotive and industrial applications....

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Power connectors deliver current density at 23.0 amps per circuit

April 1, 2014 10:01 am | Newark, Molex | Comments

Newark element14 (Chicago, IL) is now offering the Molex Mega-Fit Power Connector, delivering current density at 23.0 amps per circuit on a 5.7-millimeter pitch and row spacing. The compact form factor paired with high-current terminals provides one of the most power-dense connectors available....

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Sensor hub device features a low-power 3-axis accelerometer

April 1, 2014 9:50 am | Comments

Kionix (Ithaca, NY) announced a new integrated sensor hub device, the KX23H, combining a high-performance, very low power 3-axis accelerometer with a 32-bit ARM Cortex-M0 microcontroller in a single 3x3x0.9mm package. The KX23H also includes a library of advanced motion processing software....

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