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Power supply Suits Resistance Soldering, Heat Sealing and Conductive Adhesive Bonding

Fri, 08/27/2010 - 8:09am
ec1009ps254web-2Miyachi Unitek Corporation introduced its Uniflow3 power supply for resistance soldering, heat sealing and conductive adhesive bonding applications. Using pulsed heat technology, the Uniflow3 provides targeted heating and precision temperature control for such components as flex circuits, ribbon cables, wires, SMT components, single or dual sided edge connectors and thermocompression bonding of gold ribbon. It is widely used in the assembly of medical devices, cellular phones, on-board computers, LCD monitors, laptops, and cockpit instrumentation and displays. Uniflow3’s hardware improvements include an LCD display twice the height of the Uniflow2, with a new front panel keypad containing additional keys for easy user access to new features. Process control features now include three additional heating stages and added states for programmable relays. The Uniflow3 also includes new postheat functions, as well as a fully functional idle heat function with a warm-up that features a slow ramp up of temperature to idle after power up. Limits and alarms have been upgraded, and now feature user settable delays for the start of temperature limits and envelope. User interface upgrades include a new graph screen with settable time axis, data screen, commands allowing retrieval of actual temperature graph data, and an input/output status screen.

Miyachi Unitek Corporation
626-303-5676, www.muc.miyachi.com
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