Heat Sink Screw Suits GHz Socket
Tue, 05/18/2010 - 7:06am
Ironwood Electronics introduced a series of heat sink screw for its GHz BGA socket family. The HS-SG-6002 heat sink screw is designed for 31 mm x 31 mm to 42.5 mm x 42.5 mm package size and dissipates up to 16 W with additional fan mounted on the top. In addition to heat dissipation, the heat sink screw also serves as a compression mechanism for the GHz socket. The heat sink screw threads into the socket lid which can be swivel open from the socket base. After placing the IC inside the socket cavity, swivel the lid and turn the heat sink compression screw. This provides enough force to compress the device on to the contact element as well as optimum surface contact with IC top side for heat dissipation to keep IC’s junction temperature without exceeding its limits. The HS-SG-6002 heat sink screws are constructed with 7075 Aluminum and optimized using fin design with maximum surface area per simulation results from Qfin software.