Product Releases

Card Enables Thermal Dynamics Testing in ATR Enclosures

Mon, 03/29/2010 - 1:20pm
thermal dynamics testSIE Computing Solutions Inc., announced an ATR thermal load card designed for testing thermal dynamics in a conduction-cooled environment. The 3U x 160 mm SIE ATR thermal load card is configurable by power loads ranging from 12 W, 25 W, 50 W, and up to 200 W, and can accommodate any of the common bus structures used in ATRs such as VPX, VME and CompactPCI. The card enables users to perform thermal profiling of an ATR enclosure in order to obtain empirical data on the system’s thermal load, enabling each slot in the system to be maximized. This alleviates the need to perform testing with production-grade cards. Each slot can host a thermal load card to mirror the final system configuration in order to create an integrated system thermal profile. The ATR thermal load card features a modular precision machined T6061 aluminum frame design that is capable of being configured with a VPX, VME or cPCI front end interface. Available for multiple power ratings with a wide variety of load cards to fit any ATR architecture, the 3U ATR thermal load cards are available now, and the company will be introducing 6U ATR thermal load cards in the near future.

SIE Computing Solutions


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