Product Releases

PA & E Announces New Non-magnetic Micro-D Connectors

Fri, 01/29/2010 - 6:00am

Engineers designing electronic components for use in applications where non-magnetic characteristics are required now have a new connector option following PA&E’s announcement of its new non-magnetic Micro-D connector line.

These new Micro-D connectors combine a MIL-PRF-83513 complaint Micro-D interface with very low magnetic permeability characteristics and are particularly suitable for harsh environments where superior hermetic integrity and non-magnetic characteristics are crucial to a component’s design. The connector’s shell is comprised of titanium and Inconel because this metal combination delivers the strength, expansion coefficients and low magnetic permeability required. These metals are joined using PA&E’s unique explosive metal welding processes. Pin material options include Inconel, molybdenum or titanium.

Designed to be laser welded into PA&E’s titanium or titanium composite electronic packages, these new Micro-D connectors can be manufactured in 9,15,21,25,31,37,51 and 100 pin configurations. These connectors use PA&E’s unique polycrystalline ceramic sealing technology to deliver a leak rate of less than 1X10-9cc/sec Helium at 1 atmospheric differential pressure. The new Micro-D line provides insulation resistance of more than 5,000 Megohms at 500 VDC and exhibit no evidence of breakdown or flashover when tested in IAW MIL-STD-1344, Method 3003. They will perform reliably in temperatures ranging from -65ºC to 260ºC.

For more information about non-magnetic Micro-D connectors from PA&E, or to learn more about the company’s other interconnect products, EMI filters, and integrated electronic packaging capabilities, contact PA&E at 509-664-8000 or visit us at



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