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Clamping Devices Improve Power Transistor Performance

Thu, 01/07/2010 - 6:36am

TO270WB and TO270WBL Clamping DevicesThe TO270WB and TO270WBL Clamping Devices enhance the connection between a plastic-packaged RF Power Transistor and the ground plate of an RF amplifier.  Often these high-power plastic-packaged devices are just bolted down.  The new clamps improve both the electrical ground and the thermal ground; thus increasing P1dB, decreasing IMD3, while improving thermal performance and reliability (please see this important Application Note).  Datasheets and samples are exclusively available at Richardson Electronics, 1-800-737-6937 (North America), or www.rell.com/locations (International).

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