Die-bonding Materials Suit (HB) LED Packaging Apps
Shin-Etsu’s KER Series was developed as a die encapsulation, die-attach adhesive, and lens-type material to provide long-term reliability for applications in general-purpose lighting and the rapidly expanding HBLED category. This methyl silicone based system hardens by using a heat cured platinum catalyst. Comprised of three key products (KER-300-M2/KER-3100-U2/KER-3200-T1), the series offers a broad spectrum of silicone polymer chemistry and structural composition. In addition to providing increased adhesive strength and thermal performance, the KER products are more compatible with silicone encapsulates than epoxy-based die attach materials, according to the company, which may inhibit platinum heat cure materials. The KER series is available in clear, opaque, and white thin bond line versions to minimize light absorption and maximize heat dissipation.