Master Bond has introduced a thermal adhesive film called . It is formulated to function as the preferential heat-transfer path between heat-generating components and heat sinks or other cooling devices. The 100 percent solid, B-stage adhesive-preform provides a high bond strength solution to electronic assembly and other industrial bonding and sealing operations. It is able to cure quickly at moderate temperatures, e.g. 1 hour at 250°F (125°C) or 30 to 40 minutes at 300°F (150°C). Also, squeeze out during bonding is almost non-existent.

Master Bond
201-343-8983, www.masterbond.com 

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