Product Releases

Potting Compound Protects Heat-Sensitive Parts

Wed, 09/16/2009 - 7:44am


Master Bond's EP30M3LV low exothermic epoxy Containing no solvents or diluents, Master Bond's EP30M3LV low exothermic epoxy system formulated to help avoid excess heat buildup and damage to thermally sensitive components during potting operations. Features include a volume resistivity of 2x1015 ohm cm at 25°C, a 2-to-1 mix ratio by weight, and a mixed viscosity of 2,000-3,000 cps. The service operating temperature range is from -60°F to +250°F with a flexural strength of 14,000 psi and a tensile strength of  greater than 8,000 psi.

Master Bond


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