The HyperBGA PTFE-based "coreless" semiconductor package from Endicott Interconnect Technologies purportedly delivers digital signal speeds surpassing 12 Gb/s. The material compliance of the PTFE material supposedly eliminates the BGA wear out, die cracking, delamination, and flip chip bump fatigue. The package is intended for applications such as multi-layer, RF, chipon-flex, or any application requiring a SiP approach.
Endicott Interconnect Technologies
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Semiconductor Package Delivers Signal Speeds Exceeding 12 Gb/s
Thu, 08/27/2009 - 12:32pm