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Adhesive Optimizes Heat Dissipation

Mon, 08/03/2009 - 10:17am

 

ec99pi401a-webFeaturing thermal conductivity and electrical insulation properties, the EP30BN boron nitride epoxy adhesive from Master Bond is designed to optimize heat dissipation of aerospace, defense and microelectronic assemblies. It is formulated to cure at room temperature or more rapidly at elevated temperatures. Temperature range is from -60°F to 300°F ( 50°C to 150°C). Other features include: volume resistivity in excess of 1014 ohm cm, and thermal conductivity of 24 BTU/hr/ft2/°F/in.

Master Bond
201-343-8983, www.masterbond.com 

 

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