Addressing 3D integration of CMOS ICs into devices such as photo sensors, gas sensors, power devices, or MEMS components, the Through Silicon Via (TSV) technology from austriamicrosystems two eight-inch wafers can be electrically connected, with typical TSV depths of 200 µm to 300 µm. A proprietary back side re-distribution layer concept enables various front and back side IO pad connections. The TSV technology works with any 0.35-µm analog specialty technologies such as CMOS, HV-CMOS, SiGe BiCMOS, or embedded Non-Volatile Memory.

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+43-3136-500-4400, www.austriamicrosystems.com