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Multi-Chip Package Targets Mobile Phones

Wed, 02/18/2009 - 5:53am

Micron MCPLeveraging Micron’s 32-Gb, 34-nm MLC NAND technology, Micron Technology’s all-in-one, NAND-based multi-chip package (MCP) performs in high-end mobile phones. The product stacks 8 die to deliver 16 GB of available on-board storage, which is said to enable board-space savings of up to 40%. The unit consists of e-MMC memory combining NAND flash with a high-speed MultiMediaCard (MMC) controller; 2-Gb, 1.8-V DDR memory; and 2-Gb single-level cell (SLC) NAND.

Micron Technology
208-368-3900, www.micron.com

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