Hybrid Socket Works with 0.30-mm-Pitch Devices
Prototyping, testing, and burning in CSP (chip scale package), BGA (ball grid array), microBGA, and LGA (land grid array) devices, Aries Electronics’ CSP/BallNest ZIF-style hybrid socket operates in devices with a 0.30-mm pitch or larger. The product utilizes gold-plated pressure mount spring probes to maintain constant force throughout the entire test and burn-in cycle. The device mounts to an adapter board terminated with male thru-pins, creating a thru-hole solder tail socket for BGA devices. The socket has heat sinks, a 4-point crown, a signal path of 1.96 mm, operating temperatures from -55°C to 150°C, and an estimated contact life of 500,000 cycles. The unit offers contact forces of 15 g per contact on a 0.30-mm to 0.35-mm pitch, 16 g per contact on a 0.40-mm to 0.45-mm pitch, 25 g per contact on a 0.50-mm to 0.75-mm pitch, and 25 g per contact on a 0.80-mm pitch or larger.