Targeting semiconductor failure analysis, OptoTherm’s latest version of the Micro thermal imaging system offers a thermal imaging camera upgrade. The camera upgrade includes a 320 × 240 element uncooled detector, sensitivity of 0.05°C, a 20-µm microscopic lens, a wide angle lens, and a 16-bit digital Camera Link interface. The product measures and displays the temperature distribution over the surface of semiconductor devices. The system also comes with a tower computer and monitor, mounting platform, vertical camera stage, xy table, thermal chuck with controller, and an I/O relay module. The instrument is suitable for calculating thermal resistance, measuring junction temperature, and identifying die bond defects.