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Pin Fins Exhibit Large Footprint and Low Profile

Tue, 12/02/2008 - 11:03am

Cool hybridCombining forging and reflow manufacturing technologies, Cool Innovations’ hybrid copper/aluminum pin fins provide a cooling alternative for applications requiring heat sinks with footprints from 1.5” × 3” to 8.2” × 8.2” and heights from 0.3” to 1.3”. The devices are composed of forged aluminum pin fin heat sinks that are reflowed onto a copper plate, and weigh up to 50% lighter than identically-structured all-copper pin fin heat sinks. Uses include “hot” semiconductors, multi-device cooling in SMT environments, and embedded applications.

Cool Innovations, Inc.
905-760-1992, www.coolinnovations.com

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