Pin Fins Exhibit Large Footprint and Low Profile
Combining forging and reflow manufacturing technologies, Cool Innovations’ hybrid copper/aluminum pin fins provide a cooling alternative for applications requiring heat sinks with footprints from 1.5” × 3” to 8.2” × 8.2” and heights from 0.3” to 1.3”. The devices are composed of forged aluminum pin fin heat sinks that are reflowed onto a copper plate, and weigh up to 50% lighter than identically-structured all-copper pin fin heat sinks. Uses include “hot” semiconductors, multi-device cooling in SMT environments, and embedded applications.
Cool Innovations, Inc.