Epoxy Bonds Continuously at 400°F
Bonding dissimilar substrates, Contronics Corporation’s Duralco 125 “stress free” epoxy forms an electrically-conductive bond for continuous use to 400°F. The adhesive is appropriate for manufacturing and repairing flexible circuits, solder replacement, bonding semiconductors, EMI shielding, thermistors, wire tacking, and heating elements. The handheld applicator dispenses the mixture epoxy that cures at room temperature (16 to 24 hours at 75°F or 20 minutes at 200°F), and is said to eliminate mixing, measuring, and excess waste. The silver-based epoxy bonds to glass, ceramics, plastic, steel, aluminum, and lead. The adhesive shows resistance to moisture, chemicals, and solvents.