Thermal Software Creates IC Models
Converting models with one click, Daat Research’s CoolitPCB v4.0 thermal software allows user to construct detailed models of ball grid arrays (BGA), dual inline packages (DIP), and quad flat packages (QFP), or select IC packages from hundreds in the IC Packages Library, modify them, and save the results. The CFD software enables PCB designers to do their own board level analysis, predict the thermal behavior of their designs, and pinpoint optimum component placement on their boards. Pricing is $3,200 for an annual (node-locked) license. The optional IC Package Dialog and Library is priced at $1,500.
Daat Research Corporation