Peel Packaging Protects Integrated Circuits
Newark launched a innovative peel packaging solution designed to protect fragile integrated circuits (ICs) during shipping, storing, and handling. Currently, it is available for ICs with case sizes measuring 12 mm × 12 mm and 14 mm × 14 mm. The ICs are placed within protective recyclable plastic cells, which are then sealed with an anti-static lid. Offered at no extra charge, peel packaging provides a reduced risk of moisture ingress and easy product identification: Newark’s stock number and the manufacturer’s part number are clearly marked on the back of the package. Prior to implementing peel packaging, Newark conducted extensive customer research, which concluded that no single packaging solution works best for every IC size, shape, and pin configuration. The research also confirmed that cut tape remains the preferred choice for most smaller-sized IC devices, and Newark will soon expand its product range available in this format. The patent-pending peel packaging was developed in-house, in partnership with Newark’s sister European business, Farnell, and Antistat.