Product Releases

Epoxy Adhesive Serviceable at Cryogenic Temperatures

Mon, 05/12/2008 - 12:00pm

EP29LPSP epoxyOptically clear with a mixed viscosity of 400 cps, the EP29LPSP epoxy adhesive/sealant for cryogenic applications from Master Bond can withstand temperatures as low as 4K as well as cryogenic shocks (i.e. room temperature down to liquid helium temperatures in a 5-10 minute time period). With a mix ratio of 100 to 65 by weight, the epoxy cures at room temperatures, but best results are obtained if heat cured at 130-165°F for 6 to 8 hours. The adhesive has a tensile strength of 6,500 psi and a tensile modulus of greater than 375,000 psi and a Shore D hardness of 80. When cured, the volume resistivity is greater than 1,015 O/cm and the dielectric constant is 3.6.

Master Bond


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