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Computer-on-Module Addresses Extreme Applications

Wed, 04/23/2008 - 10:14am

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COM 840 computer-on-moduleWith an operating temperature range from -40°C to +85°C, a high level of component integration, and a PWB that is 0.093"-thick, Ampro's COM 840 computer-on-module is well-suited for use in rugged-use applications. Based on Intel’s Core2 Duo processor and GME965 chipset, the device integrates processor, RAM, graphics, networking, PCI Express expansion, and other functionalities in a 3.7 × 4.5-inch footprint. Additional features include four MB of on-chip L2 cache, an 800-MHz FSB, and two SODIMM sockets for up to 4 GB of DDR2 RAM.
The graphics subsystem uses Intel's GMA950 with 224 MB of 64-bit video RAM, and can drive displays at resolutions of up to 2048 × 1536 with an onboard video encoder for TV-out (420p, 720p, and 1080i), component, and S-Video. I/O functionality includes a gigabit Ethernet port, eight USB 2.0 channels, an AC97/HD audio controller, two SATA II, and one UDMA EIDE interface with flexible expansion via five PCIe x1 lanes, a PEG (PCIe graphics) x16 lane, PCI, and LPC buses (the x16 lane can alternately serve as a pair of SDVO channels. Embedded and desktop operating systems available include a full Ubuntu-derived Linux 2.6-based distribution, Windows Embedded CE 6.0, Windows XP Embedded, and VxWorks 6.x.

Ampro Computers
408-360-0200, www.ampro.com

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