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Hybrid Module Integrates Power and Control

Mon, 03/10/2008 - 6:21am

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signal and power management hybridIntegrating signal and power management in a single device, the control and power handling hybrid module from BI Technologies combines thermally-conductive ceramic substrates with discrete components or bare die through the use of vacuum low-flow die attach to provide a smaller and more efficient solution than comparable products. Intended for applications such as motor drives, power amplifiers, and power conversion, the module can handle currents as high as 100A and voltages as high as 1,000V and is available in versions that meet MIL-PRF-38534 Class H requirements.

BI Technologies
714-447-2345 www.bitechnologies.com

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