Interposers Enable Use of Lead-free BGA Devices in Traditional Tin/lead Reflow Profiles
BGA Interposers from Advanced Interconnections are a method for converting lead-free BGA device packages for use on boards processed with lower temperature, Tin/Lead solder profiles. Designed for RoHS exempt applications, these Interposers address BGA device transition, obsolescence, and solderability issues associated with the higher temperature requirements to process lead-free BGA packages. The turn-key solution consists of lead-free BGA device attach to an Interposer adapter board in a high temperature reflow process, followed by mounting of eutectic (63/37) Tin/Lead solder balls on the bottom of the Interposer. The Interposer assembly is shipped ready for use on existing PCBs. The company offers a complete Interposer solution including high temperature, FR-4 adapter boards that closely match the original package size, industry-proven eutectic (63/37) Tin/Lead solder balls, and in-house lead-free BGA device attach. Device-specific Interposers match the device footprint and are currently available in 0.80 mm , 1 mm and 1.27 mm pitch. Tape and reel packaging is available.