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Copper on Silicon Passive Device Technology

Mon, 08/20/2007 - 6:58am

ON Semiconductor announces its HighQ copper (Cu) on silicon (Si) integrated passive device (IPD) manufacturing services. This 8" wafer technology is suitable for the production of passive devices such as baluns, couplers and filters that are used in portable and wireless applications where higher performance equates to longer battery life. This process technology offers thick copper inductors, MIM capacitors (0.62 fF/um2) and TiN resistors (9?2). A full-featured design kit for the IPD technology is also available that enables simulation to actual first silicon results, and it includes standard Cadence design tools. A line of high bandwidth filters for electromagnetic interference (EMI) reduction applications on high speed serial interfaces is in development.
ON Semiconductor
602-244-6398, www.onsemi.com 

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