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Hermetic Microelectronic Packages

Fri, 04/27/2007 - 11:00am

ec74pi812web.jpgCPS Technologies has announced its hermetic microelectronic packages that are made from materials such as Kovar, aluminum and steel to enable communication for military, electronics, satellite and aerospace applications. AlSiC (aluminum silicon carbide) components are used in these packages that are applicable in the wireless communications infrastructure, high-performance microprocessor, motor controller and microelectronic markets.
CPS Technologies
508-222-0614, 508-222-0614

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