Flip Chip Underfill Encapsulants
Lord Corp. has announced its lead-free compatible ME-532 flip chip underfill that is specifically formulated to achieve high reliability for in-package or chip-on-board applications where fast flow under large chips is required. When anhydride based flip chip underfills are not desired, the company’s ME-541 anhydride-free flip chip underfill can be used. They are engineered to quickly flow into gaps 25µ with minimal filler settling and no voiding, encapsulating the fully populated interconnect arrays with a layer of protective polymer. Thermal shock and cycling reliability testing has shown that they are suitable for many flip chip applications including the harsh environments found in the automotive industry.