Product Releases

Flip Chip Underfill Encapsulants

Fri, 04/27/2007 - 11:34am

ec74pi802web.jpgLord Corp. has announced its lead-free compatible ME-532 flip chip underfill that is specifically formulated to achieve high reliability for in-package or chip-on-board applications where fast flow under large chips is required. When anhydride based flip chip underfills are not desired, the company’s ME-541 anhydride-free flip chip underfill can be used. They are engineered to quickly flow into gaps 25µ with minimal filler settling and no voiding, encapsulating the fully populated interconnect arrays with a layer of protective polymer. Thermal shock and cycling reliability testing has shown that they are suitable for many flip chip applications including the harsh environments found in the automotive industry.
Lord Corp.


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