Dow Corning introduced new Dispensable Thermal Pads, which are positioned as providing cost-effective thermal management in LED lighting applications. The new materials are said to enable LED lamp and luminaire manufacturers to quickly and precisely print a layer of thermally conductive silicone compound in controllable thicknesses on complex substrate shapes while ensuring excellent thermal management properties and reduced manufacturing cost. According to the company, this new technology offers the potential to reduce material costs by 30 to 60 percent by eliminating the waste more common to conventional fabricated thermal pads, enhancing thermal performance and accelerating manufacturing cycles. The new dispensable pad technology easily conforms to complex and unevenly shaped substrates and cures in place to help increase throughput and provide greater flexibility over deposited layer thickness.
Dow Corning, www.dowcorning.com