Covered-CircuitFujipoly announces the addition of Sarcon 100GR-HL to its line of specially formulated Thermal Interface Materials. This advanced gap filler pad is manufactured with a hardened top surface.

The unique, one-sided treatment is less tacky than the opposing surface allowing the thermal pad to consistently adhere to either the target electrical component or opposing heat sink. The hard surface allows for effortless removal without tearing or damaging the material during assembly and rework operations.

Sarcon 100GR-HL transfers heat with a thermal conductivity of 2.8 W/m°K and a thermal resistance of .44°Cin2/W at 72.5 PSI. This 1.0mm thick, flame retardant TIM is available in sheets up to 300mm x 200mm.