Controller kits tap into high-speed PCIe bus
May 19, 2012 12:08 pm | Product Releases | CommentsTwo new controller kits for the ScanWorks platform for embedded instruments from ASSET InterTech can, according to the company accelerate test throughput by plugging into the high-speed PCI Express (PCIe) bus in the personal computer where ScanWorks is running.
LISTED UNDER: Boards & Modules | Test & Measurement
High-speed memory test system offers multi-functionality and industry’s top test speed of 8Gbps
May 14, 2012 2:54 pm | Product Releases | CommentsAdvantest Corporation today announced the availability of its next-generation high-speed DRAM test system, the T5511. The new system, which begins shipping this month, offers the industry’s fastest test speed of 8Gbps.
LISTED UNDER: Test & Measurement
Tester targets photovoltaic modules and strings
May 14, 2012 9:32 am | Product Releases | CommentsMC Technologies’ PROFITEST-PV allows the measurement of I-U-parameters as well as photovoltaic-modules and strings. A new patented procedure enables the test unit to read peak power, serial resistance, parallel resistance at the same time. All information can
LISTED UNDER: Test & Measurement
2-in-1 insulation tester & multimeter includes wireless datalogging
May 11, 2012 1:23 pm | 3M Electronics Solutions Division | Product Releases | CommentsExtech Instruments announces the new MG300, a true RMS multimeter with built-in insulation resistance tester and the added safety of wireless datastreaming for remote monitoring and datalogging. By adding insulation testing capabilities to the ubiquitous digital multimeter, electricians are always equipped for insulation testing...
LISTED UNDER: Test & Measurement
Development kit helps build personalized pulse networks
May 8, 2012 9:48 am | Product Releases | CommentsTeseq offers a development kit that allows automotive technicians and engineers to design their own pulse networks. By using the FLX 5510 in conjunction with Teseq’s NSG 5500, automotive EMC laboratories can design their own pulses as well as
LISTED UNDER: Test & MeasurementSequans and Aeroflex to Demonstrate LTE Category 4 Throughput at CTIA
May 7, 2012 11:13 am | News | Comments4G chipmaker Sequans Communications, in collaboration with Aeroflex Incorporated, will conduct a live LTE throughput demonstration at International CTIA Wireless at Sequans' booth, number 3110, May 8-10, at the Ernest N. Morial Convention Center in New Orleans.
LISTED UNDER: Test & MeasurementGOEPEL electronics improves flexibility of JTAG I/O modules using FPGA embedded instruments
May 3, 2012 9:44 am | Product Releases | CommentsGOEPEL electronics introduced ChipVORX Module, a special FPGA based I/O module product line. The new modules are controlled via a standard TAP enabling access to the entire ChipVORX eco system of test and programming IPs for external instrumentation.
LISTED UNDER: Boards & Modules | Test & Measurement
Strain- and bridge-based USB measurement module is portable
May 1, 2012 12:37 pm | Product Releases | CommentsData Translation, Inc. announced the release of the DT9838 strain- and bridge-based acquisition module for USB. The module offers high-speed performance in a compact form factor for applications including strain, load, pressure, and other bridge-based measurements.
LISTED UNDER: Boards & Modules | Test & MeasurementOptical modulation analysis solution boosts vertical resolution to 16 bits
April 30, 2012 3:59 pm | Tektronix | Product Releases | CommentsTektronix announced that its OM4000 Series Optical Modulation Analyzer can now drive the DSA8300 Digital Sampling Oscilloscope to perform analysis on PM-QPSK, QAM, and other complex-modulation signals with higher vertical resolution than real-time based solutions at lower total system cost.
LISTED UNDER: Test & Measurement
Single-pulse LED measurement system eases binning
April 30, 2012 11:46 am | Product Releases | CommentsGigahertz-Optik has developed a measurement system for LED binning consisting of the BTS256-LED tester and LPS-20-1500 LED power supply with S-BTS256 software to assist with single pulse LED binning. Both meter, power supply and control software work in tandem to
LISTED UNDER: Optoelectronics & Displays | Test & Measurement
"Connector Saver" with stainless steel coupling nut reduces testing expense
April 25, 2012 9:31 am | Product Releases | Comments7-16 DIN connectors are large format 50 ohm interfaces designed for high power wireless telecommunications applications such as antennas, base stations, and satellite communications. Test ports are subject to minimal wear each time the connector interface is coupled and de-coupled. Contact pins and dielectrics can be damaged if connectors are misaligned during coupling.
LISTED UNDER: Packaging & Interconnects | Test & Measurement
XJTAG releases second generation PXI boundary scan solution
April 20, 2012 1:47 pm | Product Releases | CommentsXJTAG today released its second generation PXI boundary scan solution – a high speed interface that allows the integration of XJTAG boundary scan with PXI-based test systems. The PXI XJLink2 enables users of PXI chassis, such as NI LabVIEW and LabWindows, to leverage the benefits of XJTAG's XJLink2 boundary scan controller from within their integrated PXI test platform.
LISTED UNDER: Software | Test & Measurement
Magnetic rotary encoder IC offers reliable measurements in noisy industrial environments
April 18, 2012 11:36 am | Product Releases | Commentsaustriamicrosystems released the AS5048, a 14-bit magnetic encoder IC offering new features which make it easier than ever to achieve accurate, reliable angle measurements in microcontroller-based applications. The AS5048, which provides a PWM output and either an SPI or I2C interface...
LISTED UNDER: ICs | Test & Measurement
T3 Innovation launches new Tel-Scope Telecomm Test Set
April 12, 2012 1:48 pm | Product Releases | CommentsT3 Innovation (t3innovation.com) has announced the launch of the new TLA300 Tel-Scope Telecomm Test Set. Scheduled to ship in May with an MSRP of $269.95, the Tel-Scope delivers more line condition and status information than any other telephone line tester in the world.
LISTED UNDER: Test & MeasurementProbing solutions enable higher speed memory capture
April 5, 2012 10:00 am | Tektronix | Product Releases | CommentsTektronix announced the next generation of DDR3 probing solutions for logic debug and protocol validation using the Tektronix TLA7000 Series Logic Analyzers with support for DDR3-2133 MT/s and DDR3-2400 MT/s. This is the highest performing DDR3 protocol test solution in the market today.
LISTED UNDER: Test & Measurement
