Power Inductors Offer High Current and Low Resistance

March 6, 2008 6:08 am | Product Releases | Comments

Taiyo Yuden USA, Inc. announced its model CKP2520 multilayer chip power inductors that achieve better performance compared to the company’s previous CKP series parts. With an EIA 1008 case size footprint of 2.5 mm × 2.0 mm and a maximum height of 1.0 mm, the devices facilitate the design of thinner, higher-performance, multifunction cell phones, digital cameras and other battery-powered portable electronic equipment.

LISTED UNDER: Passive & Discrete Devices

Radial-Leaded Inductors Operate in Challenging EMI Environments

March 6, 2008 5:59 am | Product Releases | Comments

Datatronic Distribution, Inc. introduced its DR371-1 and DR371-2 series of radial leaded, molded inductors that combine high performance over a wide inductance range in challenging EMI operating environments with rugged packaging, ROHS compliant lead material and long-life. Depending on the specific model, the inductors feature an inductance range from 0.22 mH to 33 mH. The DCR is specified from 0.59 mohm to 42 mohm maximum over a maximum current rating from 5A to 38A.

LISTED UNDER: Passive & Discrete Devices

Coaxial Resonator Oscillator Delivers Low Phase Noise

March 6, 2008 5:53 am | Product Releases | Comments

Z-Communications, Inc. announced its model CRO2935B-LF lead free, RoHS compliant, coaxial resonator oscillator in S band (2,850 MHz to 3,020 MHz) that features ultra low phase noise performance of –109 dBc/Hz at 10 kHz offset. It offers typical tuning sensitivity of 23 MHz/V, and it provides 0 dBm output power (typical) at 8V DC supply while drawing 26 mA (typical) over the extended operating temperature range of -40°C to +85°C.

LISTED UNDER: Passive & Discrete Devices

Power Panel Potentiometer Offers a Power Rating of 6W

March 6, 2008 5:38 am | Product Releases | Comments

Vishay Intertechnology, Inc. announced its PE60 power panel potentiometer with a cermet element that features a 6-W power rating at 50°C. With US and EU bushing threads and a fully sealed package, it is intended for industrial and aeronautic control panel and heavy-duty control applications in end products such as cockpits, trucks and tractors, HVAC systems, welding machines, tooling machines, field and mine equipment, and water-resistant equipment.

LISTED UNDER: Passive & Discrete Devices

BCD Process Enables 50 Percent Power Die Size Reduction

March 3, 2008 10:20 am | Product Releases | Comments

Jazz Semiconductor has developed enhancements to its advanced Bipolar CMOS DMOS (BCD) process platform including the addition of an ultra low Rds(on) scalable NLDMOS device enables up to a 50 percent shrink in die size in most power devices.

LISTED UNDER: Passive & Discrete Devices

HCMOS Oscillator Offers High Frequency Stability and Low Aging Rate

February 26, 2008 10:46 am | Product Releases | Comments

The Connor-Winfield XO125 is a 5V Voltage Controlled Oven Compensated Controlled Crystal Oscillator (VCOCXO) with an HCMOS output. It is designed for Stratum 3E applications requiring a low aging rate and tight frequency stability. The device is housed in the standard CO8 EURO package with standard frequencies of 10 MHz and 12.8 MHz available.

LISTED UNDER: Passive & Discrete Devices

Precise OCXO Offers Stability over Wide Operating Temperatures

February 13, 2008 5:15 am | Product Releases | Comments

MtronPTI introduced the XO5120 Series OCXO, an industry standard 1” x 1.4” single OCXO that offers desired phase noise combined with stability over a wide range of operating temperatures. The series offers phase noise capabilities at -155 dBc and performance at 10 kHz offset at 10 MHz nominal frequency. This series also provides +/- 2 ppb stability performance over commercial temperatures and +/- 3 ppb over industrial temperatures

LISTED UNDER: Passive & Discrete Devices

Schottky Diode in the SOD-882L Package

January 22, 2008 8:20 am | Product Releases | Comments

Central Semiconductor Corp. announced the CFSH-4 Schottky Diode in the SOD-882L Tiny Leadless Package (TLP). The 40V, 200 mA device has a switching speed of 5ns. Designed for applications where ultra small size with reasonable power dissipation is a prime requirement, it is suitable for portable battery powered applications such as: DC/DC converters, switching circuits, and LCD backlighting.

LISTED UNDER: Passive & Discrete Devices

PCS Duplexer Minimizes Power Consumption and Improves Receiver Sensitivity

January 14, 2008 6:51 am | Product Releases | Comments

Avago Technologies announced ts 4th generation PCS duplexer. The ACMD-7403 delivers an industry best 2.7 dB maximum Tx Band insertion loss which significantly lowers power consumption, according to the company. A 3.2 dB maximum Rx Band insertion loss achieves desirable receiver sensitivity. It enhances the sensitivity and dynamic range of CDMA and UMTS receivers by providing more than 52 dB attenuation of the transmitted

LISTED UNDER: Passive & Discrete Devices

Low Capacitance ESD Protection Chips for USB Ports

January 10, 2008 7:01 am | Product Releases | Comments

OnChip Devices introduced low capacitance ESD protection devices for single and dual USB ports.  These devices protect the two data lines and the power rail of the USB 2.0 high speed interface. The ESD2100-02 and ESD2100-04 (2 and 4 channels, respectively) have a sub-1pF line capacitance to ensure minimal distortion USB signal, offering a compromise between low line-to-ground

LISTED UNDER: Passive & Discrete Devices

Inlet Filters with Earth Line Choke

January 10, 2008 6:35 am | Product Releases | Comments

Schaffner EMC extended its FN9222 inlet filter series to include the new FN9222E, which as an earth line choke for designs needing greater attenuation performance. The FN9222E outperforms Schaffner's existing IEC inlet filters and is mechanically compatible with the panel cut-outs of traditional filters. Each filter has a traditional screw mounting.

LISTED UNDER: Passive & Discrete Devices

RF Power Terminator and Attenuator for High-Frequency Applications

January 10, 2008 6:00 am | Product Releases | Comments

TT Electronics IRC released the PAT3060P high-power attenuator and RFTF surface-mount transmission line terminator, both featuring low VSWRs at high frequencies. They are useful for RF power meters, RF and microwave power amplifiers, radar, satellites, avionics, wireless communications, RF power sources, and microwave test instruments. The PAT3060P's frequency has a VSWR of less than 1.3 at 10 GHz. Attenuation values include 0, 1, 2, 3, 4, 5, 6, 7, 8, 9, 10, 16 and 20 dB.

LISTED UNDER: Passive & Discrete Devices

ESD Protection Chips Feature Sub-1 pF Line-Capacitance

January 8, 2008 6:46 am | Product Releases | Comments

OnChip Devices introduced its models ESD2100-02 and ESD2100-04 low capacitance ESD protection devices for single and dual USB ports. They protect the two data lines and the power rail of the USB 2.0 high speed interface. The low sub-1pF line-capacitance of the devices ensures minimal distortion of the 480-Mbit/s USB 2.0 signal. They offer optimum trade-off between low line-to-ground capacitance

LISTED UNDER: Passive & Discrete Devices

Miniature TCVCXO for Cellular Infrastructure

December 20, 2007 7:22 am | Product Releases | Comments

Bliley Technologies, Inc. introduced its RoHS compliant, TV105A Temperature Compensated Voltage Controlled Crystal Oscillator (TCVCXO). Designed primarily for cellular infrastructure, GPS and telecommunication system applications, the 3 mm × 5 mm series offers a miniature package coupled with very good phase noise performance, as well as a wide range of options in temperature stability, operating frequency range and electronic frequency adjustment.

LISTED UNDER: Passive & Discrete Devices

Layered Conductive Polymer Aluminum Capacitors Provide Low ESR and ESL

December 20, 2007 7:01 am | Product Releases | Comments

Nichicon Corporation released the F11 series of molded conductive polymer capacitors. The layered aluminum design provides the ultra low ESR and ESL over a wide frequency range needed in today’s high performance LSI. The series uses layered aluminum construction, conductive polymer electrolyte, and a three terminal design all in a molded package

LISTED UNDER: Passive & Discrete Devices


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