High-Resolution Image Sensors for High-Speed Applications

May 2, 2007 10:37 am | Product Releases | Comments

Cognex Corporation’s In-Sight 5600 is said to be the world’s fastest vision sensor. It offers the same design and performance as the In-Sight 5400 Series, but with twice the processing speed and memory to perform inspections at exceptional line rates. The product line includes

LISTED UNDER: Packaging & Interconnects

Aluminium Wall Mounting Enclosures

April 27, 2007 11:37 am | Product Releases | Comments

METcase, a division of OKW Enclosures, has launched its ‘DATAMET’ line of aluminum wall cases for indoor wall mounted electronics. Typical applications include control units, measurement systems, medical equipment, safety and security systems, communication devices and machine controllers. They consist of a die-cast front bezel which is located on the folded aluminum case body and rear panel

LISTED UNDER: Packaging & Interconnects

Flip Chip Underfill Encapsulants

April 27, 2007 11:34 am | Product Releases | Comments

Lord Corp. has announced its lead-free compatible ME-532 flip chip underfill that is specifically formulated to achieve high reliability for in-package or chip-on-board applications where fast flow under large chips is required. When anhydride based flip chip underfills are not desired, the company’s ME-541 anhydride-free flip chip underfill can be used.

LISTED UNDER: Packaging & Interconnects

Miniature Enclosure

April 27, 2007 11:25 am | Product Releases | Comments

Elma Electronic announced AG's Guardbox 33 that complies with IP 30, while in other unvented versions it can meet IP 65 (protected from dust and low-pressure water jets). This combined EMC version meets both IP 54 and 40 dB at 1 MHz. Fabricated from aluminum sections, the enclosure is suitable for measurement, control and test instrumentation

LISTED UNDER: Packaging & Interconnects

Designer ABS Enclosures(2)

April 27, 2007 11:17 am | Product Releases | Comments

TEKO's 'OVOTEK' cases are designed for the latest hand-held and portable electronics. These plastic enclosures feature advanced ergonomics for comfortable handling and operation of the controls during use. Applications include remote control devices, peripherals, measurement instruments, and medical and wellness equipment

LISTED UNDER: Packaging & Interconnects

Hermetic Microelectronic Packages

April 27, 2007 11:00 am | Product Releases | Comments

CPS Technologies has announced its hermetic microelectronic packages that are made from materials such as Kovar, aluminum and steel to enable communication for military, electronics, satellite and aerospace applications. AlSiC (aluminum silicon carbide) components are used

LISTED UNDER: Packaging & Interconnects

DIN-Rail Cases Allow Multiple Connections

April 27, 2007 10:46 am | Product Releases | Comments

OKW extended their ‘RAILTEC-B’ DIN-Rail enclosures with a series that allows different types of terminals to be accommodated within the same enclosure. The cases are suitable for a wide variety of industrial electrical and electronic applications such as machine and process control and panel building. The enclosures conform to DIN 43 880, unit 1 and are fully insulated and protected to VBG4 as well as

LISTED UNDER: Packaging & Interconnects

Logic Analyzer Adapter Helps Engineers debug low power SDRAM

April 24, 2007 7:54 am | Keysight Technologies | Product Releases | Comments

Ironwood Electronics’ PB-BGA60C-DDRRAM-RIGID-01 Logic Analyzer Adapter allows high-speed operation simultaneously enabling memory device analysis used in PDAs, Cellphones, Digital cameras and MP3 players using Agilent 16XXX Logic Analyzer System. Features include shortest possible trace length for maximum speed, low inductance, low capacitance, micro via, 5 mil line/space rigid PCB design technology.

LISTED UNDER: Packaging & Interconnects

Low Profile Micro SD Connectors

April 18, 2007 5:14 am | Product Releases | Comments

Fujitsu Components America, Inc. released a very low-profile connector for micro SD/TransFlash cards. Featuring the company’s precise die-and-molding technology, the FCN-560 series micro SD connector measures 15 mm x 14 mm x 1.6 mm and has a life cycle of ten thousand insertions/withdrawals

LISTED UNDER: Packaging & Interconnects

Vertical D-Sub Connectors

April 9, 2007 12:55 pm | Product Releases | Comments

ERNI Electronics announced a series of vertical D-Sub connectors equipped with THR (Thru-Hole Reflow) termination. The male and female vertical connectors are available in module heights of 6.0 mm, 6.3 mm, and 9.0 mm, in accordance with DIN 41652 and CECC 75301-802

LISTED UNDER: Packaging & Interconnects

BNA and RCA Connectors - Packaging & Interconnects

April 5, 2007 12:41 pm | Product Releases | Comments

Belden added BNC and RCA connectors to its family of A/V products for the professional broadcast and entertainment industry. The connectors are available in both straight and right angle versions, and they feature

LISTED UNDER: Packaging & Interconnects

Floating Panel Fasteners Compensate for Mating Hole Misalignment – Packaging & Interconnects

April 5, 2007 12:33 pm | Product Releases | Comments

PEM Hybrid floating panel fastener assemblies can be installed into any thin panel material and readily allow for radial float to compensate for mating hole misalignment up to .060”/1.52 mm. These metal/plastic fasteners are suited where subsequent access may be necessary. Fully captive steel screws keep parts to a minimum and eliminate risks associated

LISTED UNDER: Packaging & Interconnects

SIM Card Holders

April 2, 2007 12:58 pm | Product Releases | Comments

Alpha Micro Components is distributing a range of SIM card holders, which include the AMC-ICA-521, AMC-ICA-567 and the AMC-ICC-313, said to be

LISTED UNDER: Packaging & Interconnects

Sequential Mating System

April 2, 2007 12:46 pm | Product Releases | Comments

ITT’s VEAM NRG sequential mating system is presented in a 19-inch rack format and guarantees

LISTED UNDER: Packaging & Interconnects

Metallic Optical Connectors for Extreme Environments

March 30, 2007 11:50 am | Product Releases | Comments

Molex has introduced the LC2™ Metallic Optical Connectors to provide a ruggedized, all-metal housing version of its LC Small Form Factor (SFF) family. Designed specifically to

LISTED UNDER: Packaging & Interconnects


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