Enclosure Helps Manage and Protect Deeper Servers and Larger Volumes of Cable

August 21, 2007 5:17 am | Product Releases | Comments

APC announced the NetShelter SX 1200 mm Deep Enclosure, a complement to its existing NetShelter SX enclosures. The enclosure offers an innovative cable management design, including an additional pair of cable channels at the rear of the enclosure to enable organization of more power and data cables. These rear cable channels also offer additional room at the back of the enclosure to mount power distribution and enable the mounting of as many as four vertical rack power distribution units (PDUs) on one side of the enclosure

LISTED UNDER: Packaging & Interconnects

Stainless Self-Clinching Fasteners Resist Corrosion in Flush-Mount Applications

August 20, 2007 10:15 am | Product Releases | Comments

PEM announced the type SFP self-clinching fasteners which are suited for flush-mount attachment applications where corrosion resistance may be required. These fasteners permanently join two metal sheets to create a flush-attachment connection without protrusions on either side and can serve as practical alternatives for rivets or welding. Their rotational capability extends application potential by enabling a single fastener to act as a hardened pivot point.

LISTED UNDER: Packaging & Interconnects

Flat Pin Staked Flex Jumpers

August 16, 2007 10:36 am | Product Releases | Comments

Aries Electronics introduced its line of RoHS-compliant flat pin staked flex jumpers, which are suitable for any application where a signal is jumped from one board location to another. The jumper series 171, 172 and 173 combine thin, flexible, solid copper conductors embedded between layers of tough, flexible, flame retardant insulation. With a polyimide covering and acrylic adhesive, the RoHS-compliant jumper series, equipped with flame retardant cable, can withstand extreme temperatures.

LISTED UNDER: Packaging & Interconnects

Edgecard Connectors to Accommodate 0.031” to 0.125” Thick Daughtercards

August 13, 2007 5:56 am | Product Releases | Comments

Sullins Electronics announced standard edgecard connectors engineered to accept daughtercards ranging in thickness of from 0.031” (0.79 mm) to 0.125” (3.18 mm). Supplied with contact centers of 0.100” (2.54 mm), 0.125” (3.18 mm), and 0.156” (3.96 mm), they are manufactured to meet or exceed the industry’s highest electrical and mechanical standards

LISTED UNDER: Packaging & Interconnects

Low-Profile FPC ZIF Connector for Small Consumer Electronics

August 9, 2007 5:19 am | Product Releases | Comments

FCI developed a 0.3 mm-pitch, low-profile FPC ZIF connector suitable for mobile phone, digital still and video cameras, and display applications. Designated the YLL Series, the connector is available in two versions -- the D-Series with down-side contacts and the U-Series with upper-side contacts. The YLL-D provides 0.3 mm spacing, 13 to 45 down-side contact positions, and a maximum height of 1.0 mm.

LISTED UNDER: Packaging & Interconnects

Thermal Interface Pads Provide Low Thermal

August 8, 2007 4:53 am | Product Releases | Comments

MH&W International announced Keratherm 86/82, a high tensile strength, thermal interface material (TIM) that improves heat transfer from ICs and other components to their heat sinks, and provides durability for installation and long-term use. It is a thermally conductive, electrically isolating silicone film with a reinforcing fiberglass layer for tear and cut-through resistance. The silicone provides excellent wetting properties for filling interface surfaces.

LISTED UNDER: Packaging & Interconnects

Connectors for HD Audio and Video

August 3, 2007 7:26 am | Product Releases | Comments

Kycon presents its KDMIX series—a new series of HDMI (high definition multimedia interface) connectors for consumer products such as digital televisions, set-top boxes and DVD players. The specification was developed to meet the demand for high definition audio and video by enabling high bandwidth to support high-definition video and multi-channel digital in a single cable.

LISTED UNDER: Packaging & Interconnects

Shielded Compact Ribbon I/O Interconnect System

August 3, 2007 7:15 am | Product Releases | Comments

3M Electronic Solutions Division introduces its brand shielded compact ribbon (SCR) I/O interconnect system that consists of an assortment of 10-pin shielded I/O connectors and accessories. Built around a robust ribbon style contact interface for repetitive plug/unplug applications, the SCR system’s contact is capable of carrying either signal or power

LISTED UNDER: Packaging & Interconnects

Low Cure-Temperature Epoxy Preform

August 3, 2007 5:57 am | Product Releases | Comments

Uni-form epoxy preforms, manufactured by Multi-Seals, are available in a low cure-temperature epoxy called DC-202LT. DC-202LT will cure as fast as 5 minutes at 175°C (350°F) or at temperatures as low as 100°C (212°F) for 2 hours. This epoxy is suitable for sealing components that cannot withstand the cure temperatures of many heat-activated epoxies. The faster cure of the epoxy is also a benefit for large-scale sealing operations that require quicker cure schedules. Its preforms are one-part epoxy resins that are solid at room temperature. Close tolerances on preform configurations, consistent pre-mixed ratios of resin to catalyst

LISTED UNDER: Packaging & Interconnects

30W CEC-Compliant Adapter with Interchangeable Plugs

August 2, 2007 5:14 am | Phihong | Product Releases | Comments

Phihong USA announces the expansion of its adapter line with a 30W version designed for worldwide use.  Designated the PSC30R Series, the 30W adapter is available with four interchangeable clip adapter plugs for use in virtually any power outlet around the world.  This worldwide adapter allows a single part number to be used, simplifying inventory controls and approvals.  This series of adapters is suitable for applications involving point-of-sale equipment, test equipment, network equipment and battery chargers. The adapter is

LISTED UNDER: Packaging & Interconnects

Interposers Enable Use of Lead-free BGA Devices in Traditional Tin/lead Reflow Profiles

August 1, 2007 5:29 am | Product Releases | Comments

BGA Interposers from Advanced Interconnections are a method for converting lead-free BGA device packages for use on boards processed with lower temperature, Tin/Lead solder profiles. Designed for RoHS exempt applications, these Interposers address BGA device transition, obsolescence, and solderability issues associated with the higher temperature requirements to process lead-free BGA packages.

LISTED UNDER: Packaging & Interconnects

Wire-to-Board 0.6 mm Pitch Insulation Displacement Connector Said to be World’s Smallest

July 30, 2007 11:51 am | Product Releases | Comments

The XSR Series Wire-to-Board connector from JST Corp. is said to be the world’s smallest 0.6 mm pitch insulation displacement (ID) connector for discrete wires. This connector has a mounting height of 1.45 mm and a depth of 3 mm. The twin U-slot along with a new design approach for wire strain relief ensures a reliable contact/connector system. It features a secure locking design between the socket housing and PCB assembly

LISTED UNDER: Packaging & Interconnects

PCB Connectors for Higher Voltage Applications

July 25, 2007 7:52 am | Product Releases | Comments

The newest PCB terminal blocks and plug connectors/headers from Phoenix Contact’s COMBICON Power line are appropriate for increased voltage in a power application. The GMSTB(A) 2.5 HC(V) is a high-voltage header and plug with screw connection for wire-to-board applications.  It features a 7.62 mm pitch and voltage ratings (1,000 V IEC, 600V UL).  Enlarged wire and screw entry funnels result in bigger clearance and creepage distances. Integrated double-steel covering springs provide

LISTED UNDER: Packaging & Interconnects

Spring Contact is Vibration Resistant

July 20, 2007 4:54 am | Product Releases | Comments

RIA CONNECT, Inc. introduced the ASM01Y spring contact is a single pole, vibration resistant, SMD which allows for a solderless termination. The construction allows the connection of pinned components and individual solid wires ranging in size from 18 to 14 AWG, or stranded wires with ferrules. The device is suitable for SMT applications and is available in tape and reel. The device is THR compatible and can withstand soldering temperatures of 290°C for 90 seconds

LISTED UNDER: Packaging & Interconnects

Barrier Strip EMI Filtered Terminal Blocks Offer 90° Lead Bends

July 18, 2007 5:05 am | Product Releases | Comments

Spectrum Control, Inc. introduced a custom EMI filtered barrier strip terminal block with pre-bent leads to allow for easier installation on printed circuit boards (PCBs). These terminal blocks are appropriate for filtering power supplies in telecommunications equipment, metering, instrumentation, EDP equipment and industrial controls. The barrier strip filtered terminal block is designed to provide desirable EMI/RFI filtering of AC and DC power and control lines, and it is UL recognized and CSA approved for DC voltages, has a

LISTED UNDER: Packaging & Interconnects


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