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Shielded Compact Ribbon I/O Interconnect System

August 3, 2007 7:15 am | Product Releases | Comments

3M Electronic Solutions Division introduces its brand shielded compact ribbon (SCR) I/O interconnect system that consists of an assortment of 10-pin shielded I/O connectors and accessories. Built around a robust ribbon style contact interface for repetitive plug/unplug applications, the SCR system’s contact is capable of carrying either signal or power

LISTED UNDER: Packaging & Interconnects

Low Cure-Temperature Epoxy Preform

August 3, 2007 5:57 am | Product Releases | Comments

Uni-form epoxy preforms, manufactured by Multi-Seals, are available in a low cure-temperature epoxy called DC-202LT. DC-202LT will cure as fast as 5 minutes at 175°C (350°F) or at temperatures as low as 100°C (212°F) for 2 hours. This epoxy is suitable for sealing components that cannot withstand the cure temperatures of many heat-activated epoxies. The faster cure of the epoxy is also a benefit for large-scale sealing operations that require quicker cure schedules. Its preforms are one-part epoxy resins that are solid at room temperature. Close tolerances on preform configurations, consistent pre-mixed ratios of resin to catalyst

LISTED UNDER: Packaging & Interconnects

30W CEC-Compliant Adapter with Interchangeable Plugs

August 2, 2007 5:14 am | Phihong | Product Releases | Comments

Phihong USA announces the expansion of its adapter line with a 30W version designed for worldwide use.  Designated the PSC30R Series, the 30W adapter is available with four interchangeable clip adapter plugs for use in virtually any power outlet around the world.  This worldwide adapter allows a single part number to be used, simplifying inventory controls and approvals.  This series of adapters is suitable for applications involving point-of-sale equipment, test equipment, network equipment and battery chargers. The adapter is

LISTED UNDER: Packaging & Interconnects
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Interposers Enable Use of Lead-free BGA Devices in Traditional Tin/lead Reflow Profiles

August 1, 2007 5:29 am | Product Releases | Comments

BGA Interposers from Advanced Interconnections are a method for converting lead-free BGA device packages for use on boards processed with lower temperature, Tin/Lead solder profiles. Designed for RoHS exempt applications, these Interposers address BGA device transition, obsolescence, and solderability issues associated with the higher temperature requirements to process lead-free BGA packages.

LISTED UNDER: Packaging & Interconnects

Wire-to-Board 0.6 mm Pitch Insulation Displacement Connector Said to be World’s Smallest

July 30, 2007 11:51 am | Product Releases | Comments

The XSR Series Wire-to-Board connector from JST Corp. is said to be the world’s smallest 0.6 mm pitch insulation displacement (ID) connector for discrete wires. This connector has a mounting height of 1.45 mm and a depth of 3 mm. The twin U-slot along with a new design approach for wire strain relief ensures a reliable contact/connector system. It features a secure locking design between the socket housing and PCB assembly

LISTED UNDER: Packaging & Interconnects

PCB Connectors for Higher Voltage Applications

July 25, 2007 7:52 am | Product Releases | Comments

The newest PCB terminal blocks and plug connectors/headers from Phoenix Contact’s COMBICON Power line are appropriate for increased voltage in a power application. The GMSTB(A) 2.5 HC(V) is a high-voltage header and plug with screw connection for wire-to-board applications.  It features a 7.62 mm pitch and voltage ratings (1,000 V IEC, 600V UL).  Enlarged wire and screw entry funnels result in bigger clearance and creepage distances. Integrated double-steel covering springs provide

LISTED UNDER: Packaging & Interconnects

Spring Contact is Vibration Resistant

July 20, 2007 4:54 am | Product Releases | Comments

RIA CONNECT, Inc. introduced the ASM01Y spring contact is a single pole, vibration resistant, SMD which allows for a solderless termination. The construction allows the connection of pinned components and individual solid wires ranging in size from 18 to 14 AWG, or stranded wires with ferrules. The device is suitable for SMT applications and is available in tape and reel. The device is THR compatible and can withstand soldering temperatures of 290°C for 90 seconds

LISTED UNDER: Packaging & Interconnects

Barrier Strip EMI Filtered Terminal Blocks Offer 90° Lead Bends

July 18, 2007 5:05 am | Product Releases | Comments

Spectrum Control, Inc. introduced a custom EMI filtered barrier strip terminal block with pre-bent leads to allow for easier installation on printed circuit boards (PCBs). These terminal blocks are appropriate for filtering power supplies in telecommunications equipment, metering, instrumentation, EDP equipment and industrial controls. The barrier strip filtered terminal block is designed to provide desirable EMI/RFI filtering of AC and DC power and control lines, and it is UL recognized and CSA approved for DC voltages, has a

LISTED UNDER: Packaging & Interconnects
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Self-Clinching Steel Locknuts Meet Demanding Locking Performance Requirements

July 17, 2007 11:36 am | Product Releases | Comments

PEM Tri-Dent self-clinching steel locknuts incorporate a unique locking feature to meet demanding locking performance requirements and promote reliability of locking threads for thin-metal component assemblies. Their TRI-DENT locking feature can achieve locking torque specifications ranging from (maximum torque) 5.75 in. lbs./0.67 N•m to 35 in. lbs./4 N•m and (minimum torque) 0.4 in. lbs./0.04 N•m to 3.75 in. lbs./0.30 N•m, depending on fastener thread size

LISTED UNDER: Packaging & Interconnects

High Performance Semiconductor Packages

July 5, 2007 11:26 am | Product Releases | Comments

StratEdge announces its line of high performance semiconductor packages in hermetic versions. The packages fit applications for high speed digital (OC-48, OC-192, OC-768), mixed signal, broadband wireless, satellite, point-to-point and point-to-multipoint, VSAT and test in the aerospace, telecommunications, automotive and optoelectronics industries. The LCC family of packages is designed for

LISTED UNDER: Packaging & Interconnects

Heat-Shrinkable Tubing

July 5, 2007 11:22 am | Product Releases | Comments

Tyco Electronics introduces its Raychem brand URHT heat-shrinkable tubing with an eight-to-one shrink ratio. The tubing is flame retardant, black, cross linked polyolefin tubing with an ultra high shrink ratio, making it suitable for applications where the tubing must conform to an oddly shaped substrate or fit over large objects like

LISTED UNDER: Packaging & Interconnects

Independent Universal SMT Contact

July 5, 2007 11:17 am | Product Releases | Comments

ITT Electronic Components releases its series of independent universal range of SMT contacts that provides an electrical connection between a device and a PCB. Manufactured as a single piece stamped product, incorporating pre-load and anti-lift features, these contacts have been designed to replace traditional interfaces where the contact is custom designed into the component.

LISTED UNDER: Packaging & Interconnects

Double Row SMT Strip Socket

July 5, 2007 10:54 am | Product Releases | Comments

Mill-Max introduces a double row SMT strip socket which accepts .025" to .037" diameter and .025" square pins. This double-row connector is offered standard in 4 (2 × 2) up to 100 (2 × 50) position configurations on .100" spacing. The .276" tall insulator is manufactured with high temperature thermoplastic suitable for reflow soldering operations. Each precision-machined receptacle contains a proprietary #47 contact clip that is rated at 4.5A per position.

LISTED UNDER: Packaging & Interconnects

40 GHz Bandwidth Socket

July 5, 2007 10:17 am | Ironwood Electronics, Inc. | Product Releases | Comments

Ironwood Electronics introduces its DG-QFN40C-01 socket that is designed for a 5 mm × 5 mm package size, operating at bandwidths up to 40 GHz with less than 1 dB of insertion loss. The sockets are designed to dissipate up to several Watts without extra heat sinking, and they can handle up to 100W with a custom heat sink. The contact resistance is typically 3 m? per pin. The socket connects all pins and the optional center power pad with 40+ GHz bandwidth on all connections

LISTED UNDER: Packaging & Interconnects

Low Profile FPC Connectors

July 5, 2007 10:09 am | Product Releases | Comments

Omron Electronic Components LLC announces its series of low profile FPC connectors that feature a rotary locking mechanism for easy operation and secure mounting in tight workspaces. These connectors are suitable for high-density tight packaging applications such as PDAs, cell phones, media players, digital cameras, video players..

LISTED UNDER: Packaging & Interconnects

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