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Single Row Nano Connectors Available for Direct PCB to Connector Configuration

May 23, 2007 5:58 am | Product Releases | Comments

Omnetics launched a single row version of its Nano-Miniature Bi-Lobe 0.025” pitch connector family, designed to deliver ultra-reliable signal contact direct from the PCB into the connector. With a profile of only 0.115” high, these connectors incorporate the company’s proven Flex Pin contact and are the lowest profile metal-shelled connector available on the market. The connectors are available in

LISTED UNDER: Packaging & Interconnects
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Interconnect Provides Vertical PCB Connections with Laminations Instead of Plated-Thru-Holes

May 22, 2007 5:35 am | Product Releases | Comments

Endicott Interconnect Technologies announced HPC-Z interconnections which provide signal connections only where desired, with functional isolation for single or double side surface mount partitions. The HPC-Z interconnect solves thick board drilling and wire density problems, and meets the need for functional isolation, with

LISTED UNDER: Packaging & Interconnects

Expanded Torque Selection Enhances Position-Control Hinge Flexibility

May 14, 2007 5:11 am | Product Releases | Comments

Southco expanded its line of CEMA E6 constant torque position control hinges to provide greater torque-control functionality across a range of applications—industrial and electronics enclosure doors, contoured headrests for automotive and airplane seats, and LCD display screens found on medical or industrial equipment

LISTED UNDER: Packaging & Interconnects

Totally Transparent NEMA-Rated Enclosure

May 10, 2007 12:36 pm | Product Releases | Comments

Bud Industries, Inc announced the BT series of NEMA-rated enclosure, the first such enclosures to be totally transparent according to the company. Because users can see inside the box from every direction, users can inspect for moisture and read indicators without opening the seal, leading to a reliable environmental protection of electronic components.

LISTED UNDER: Packaging & Interconnects

Microscopic Glass Beads

May 7, 2007 7:58 am | Product Releases | Comments

The GBC Materials division of Morgan Advanced Ceramics (MAC) has introduced its microscopic-sized glass beads for the electronics industry. Designed to produce hermetic seals that secure against outside elements, they are suitable for a variety of applications including miniature fuse bodies

LISTED UNDER: Packaging & Interconnects

Liquid-Tight Conduit Fittings

May 7, 2007 7:52 am | Product Releases | Comments

Cooper Crouse-Hinds has introduced its LiQuik liquid-tight conduit fittings. Designed to meet the needs of wet or corrosive environments, they eliminate the need to disassemble the fitting to attach it to the liquid-tight conduit. Instead, it is installed by turning the conduit to attach it to the ferrule inside the assembled fitting and tightening the nut.

LISTED UNDER: Packaging & Interconnects

Optically Clear Epoxy

May 7, 2007 7:44 am | Product Releases | Comments

Master Bond, Inc. introduced a transparent, versatile epoxy for general purpose bonding, casting, coating and potting called EP30HT. It combines extraordinary physical strength, exceptional resistance to elevated temperatures and humidity, and chemical resistance properties with an optical clarity of over 97 percent spectral transmittance.

LISTED UNDER: Packaging & Interconnects

Composite Camera Cables

May 7, 2007 7:41 am | Product Releases | Comments

Belden introduced its Brilliance Composite Camera cables that are designed to deliver outstanding video and audio functionality to ENG/EFP cameras. Using two of the company’s A/V coaxial cables and four audio pairs, the model #1347A composite camera cable is suitable for the interconnection of digital remote field cameras in SDI/HDTV applications that include live or recorded

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Cable Configuration Design Tool

May 7, 2007 7:39 am | Product Releases | Comments

Visual Communications Company’s Web-based cable configuration design tool helps in the component selection process of designing a custom panel mounted LED cable assembly. The user selects the socket for the LED, lens style and termination, then adds the multiple of LEDs

LISTED UNDER: Packaging & Interconnects

ESE Terminal Blocks

May 7, 2007 7:30 am | Product Releases | Comments

Molex introduced its line of Eurostyle PCB terminal blocks that includes more than 50 designs or housing styles of plugs, headers and fixed terminal blocks that are fully RoHS compliant. Available in four pitches from 3.50 mm to 5.08 mm (.138" to .197"), these ESE PCB terminal blocks are well-suited for a variety of applications

LISTED UNDER: Packaging & Interconnects

High-Resolution Image Sensors for High-Speed Applications

May 2, 2007 10:37 am | Product Releases | Comments

Cognex Corporation’s In-Sight 5600 is said to be the world’s fastest vision sensor. It offers the same design and performance as the In-Sight 5400 Series, but with twice the processing speed and memory to perform inspections at exceptional line rates. The product line includes

LISTED UNDER: Packaging & Interconnects

Aluminium Wall Mounting Enclosures

April 27, 2007 11:37 am | Product Releases | Comments

METcase, a division of OKW Enclosures, has launched its ‘DATAMET’ line of aluminum wall cases for indoor wall mounted electronics. Typical applications include control units, measurement systems, medical equipment, safety and security systems, communication devices and machine controllers. They consist of a die-cast front bezel which is located on the folded aluminum case body and rear panel

LISTED UNDER: Packaging & Interconnects

Flip Chip Underfill Encapsulants

April 27, 2007 11:34 am | Product Releases | Comments

Lord Corp. has announced its lead-free compatible ME-532 flip chip underfill that is specifically formulated to achieve high reliability for in-package or chip-on-board applications where fast flow under large chips is required. When anhydride based flip chip underfills are not desired, the company’s ME-541 anhydride-free flip chip underfill can be used.

LISTED UNDER: Packaging & Interconnects

Miniature Enclosure

April 27, 2007 11:25 am | Product Releases | Comments

Elma Electronic announced AG's Guardbox 33 that complies with IP 30, while in other unvented versions it can meet IP 65 (protected from dust and low-pressure water jets). This combined EMC version meets both IP 54 and 40 dB at 1 MHz. Fabricated from aluminum sections, the enclosure is suitable for measurement, control and test instrumentation

LISTED UNDER: Packaging & Interconnects

Designer ABS Enclosures(2)

April 27, 2007 11:17 am | Product Releases | Comments

TEKO's 'OVOTEK' cases are designed for the latest hand-held and portable electronics. These plastic enclosures feature advanced ergonomics for comfortable handling and operation of the controls during use. Applications include remote control devices, peripherals, measurement instruments, and medical and wellness equipment

LISTED UNDER: Packaging & Interconnects

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