QFN socket includes 31 gram actuation force per pin
July 18, 2012 9:50 am | Ironwood Electronics, Inc. | Product Releases | CommentsIronwood Electronics recently introduced a new QFN socket addressing high performance requirements for 0.5mm pitch devices - SBT-QFN-4016. The contactor is a stamped spring pin with 31 gram actuation force per pin and cycle life of 500,000 insertions. The self inductance of the contactor is 0.88 nH, insertion loss of < 1 dB at 15.7 GHz and capacitance 0.097pF.
LISTED UNDER: ICs | Packaging & Interconnects
Symmetrical adapters can handle up to 300 watts of power at 2.7 GHz
July 16, 2012 2:30 pm | Product Releases | CommentsMolex Incorporated and Radiall announced the continued collaboration and expansion of their cost-effective SMP-MAX series with new symmetrical adapters and RF coaxial interconnect solutions for board-to-board, module-to-module and panel-to-panel telecom applications. As a second source, Molex is designing, manufacturing and marketing these connectors for global customers.
LISTED UNDER: Packaging & Interconnects
Cable assemblies designed to support system integrators
July 13, 2012 11:24 am | Product Releases | CommentsSan-tron, Inc., has introduced its new line of SRX cable assemblies for low PIM requirements. The SRX line is an engineered suite of low PIM cable assemblies designed to support system integrators. Several different deployment scenarios encompassing cabinet integration, short cable runs or jumper applications, long haul cable runs, indoor use, outdoor use, riser, and plenum environments, have been accommodated for and include interconnect options for SMA, N, 7/16, and TNC mating.
LISTED UNDER: Packaging & Interconnects
Push-pull connectors promise space and time savings
July 11, 2012 9:15 am | Product Releases | CommentsIntelliconnect (Europe) Ltd. announced a complete range push-pull connectors that rival screw and locking types. The company states they offer panel designers space savings since there is no need for a coupling-tool or locking by hand and fast and easy mating and un-mating for
LISTED UNDER: Packaging & Interconnects
I/O interfaces enable terabit system bandwidth
July 10, 2012 11:28 am | Product Releases | CommentsFCI has developed a complete line of high-speed I/O interfaces that enable terabit system bandwidth. Designated the XLerate Series, the high-speed I/O cabling solutions are available in both copper and fiber optic options scaling from 10 Gb/s to 150 Gb/s, in the three most commonly used industry standard form factors — the SFP+, QSFP+ and CXP form factors.
LISTED UNDER: Packaging & Interconnects
Three phase bridge assemblies feature low thermal resistance for increased output current
July 6, 2012 11:09 am | Product Releases | CommentsSolid State Devices, Inc. announced their enhanced SDA312A - SDA312G and SDA312AF - SDA312GF series of three phase bridge assemblies.
LISTED UNDER: Boards & Modules | Cooling & Thermal Management | Packaging & Interconnects
Overvoltage clamp perfect for portable applications
July 3, 2012 2:43 pm | Product Releases | CommentsDiodes Incorporated has introduced an overvoltage clamp for the protection of power management ICs (PMIC) in portable applications. Provided in the small form factor 1.1mm x 1.4mm x 0.8mm W-DFN1114-3 package, the AP9060 is suitable for the latest generation battery-backed products including smart phones, tablets and ultra mobile PCs.
LISTED UNDER: Packaging & InterconnectsPVC elastomers for electric vehicle charger cable provide cost-effective alternatives in insulation and jacketing
June 28, 2012 9:16 am | Product Releases | CommentsTwo Flexalloy PVC elastomer compounds from Teknor Apex Company provide manufacturers of charger cable for electric vehicles (EVs) with more cost-effective alternatives to other elastomers in both insulation and jacketing, the company announced today. Teknor Apex will introduce the products at Wire China (Stand W1-C12).
LISTED UNDER: Packaging & Interconnects
Fuse clip designed for heavy-duty performance
June 28, 2012 8:51 am | 3M Electronics Solutions Division | Product Releases | CommentsSchurter is expanding its range to include a fuse clip designed for heavy-duty performance. The CSO fuse clip for 10.3 x 38 mm or 10.3 x 85mm fuses, is suitable for applications with voltages up to 1500 VAC/VDC and currents to 32A. The fuse clip’s unique characteristics meets or exceeds the present need for increasing photovoltaic system voltages.
LISTED UNDER: Packaging & Interconnects
Microwave coaxial cables feature solid core or monofilament dielectric for desirable signal speed and improved electrical performance
June 26, 2012 3:18 pm | Product Releases | CommentsTemp-Flex LLC, a subsidiary of Molex Incorporated, announced the availability of microwave coaxial cables designed for high-bandwidth applications using proprietary processes.
LISTED UNDER: Packaging & Interconnects | RF & Microwave/Communications
Dielectric cure monitoring solutions provide insight about thermoset materials
June 26, 2012 10:06 am | Product Releases | CommentsLambient Technologies LLC announced instruments, sensors and software for monitoring the dielectric properties of curing polymers. These properties provide insight into the chemistry, formulation, reaction rate, viscosity and cure state of epoxies, polystyrenes, polyurethanes, silicones, SMC, BMC and
LISTED UNDER: Packaging & Interconnects | Sensors & Actuators | Test & Measurement
Extruded aluminum enclosures feature wall mounting
June 25, 2012 1:53 pm | Product Releases | CommentsTEKO Enclosure Solutions extends the TEKAL series of extruded aluminum enclosures with TEKAL-E.
LISTED UNDER: Packaging & Interconnects
H4 solar connector offers stamped and formed contact option for use up to 1000V
June 18, 2012 4:39 pm | Product Releases | CommentsAmphenol Industrial Global Operations now offers a low cost stamped and formed contact option for its H4 solar connector, in addition to the existing machined contact.
LISTED UNDER: Packaging & Interconnects
Patch cable includes "fingerless" release mechanism
June 18, 2012 2:47 pm | Product Releases | Commentstrans data elektronik introduces a new concept as an extension of the successful cabling system tML-tde Modular Link, which is based on the LC connector type. The new tML-tde Modular Link extension provides an ingenious packing density and is easy to use. A newly developed release mechanism allows the plug to be released "fingerless"...
LISTED UNDER: Packaging & Interconnects
Colored split loom highly flexible, kick resistant
June 18, 2012 11:21 am | Product Releases | CommentsMicro Plastics’ has added COLOR to their Polyethylene and Nylon lines of wire routing split loom. To satisfy customer demand, they now offer all sizes of their Nylon Split Loom in orange, to accommodate applications where identification is critical to safety.
LISTED UNDER: Packaging & Interconnects
