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Low Profile Modular Jack Components

September 26, 2007 7:29 am | Product Releases | Comments

ERNI Electronics announces its line of modular jack components to include low profile versions with integrated magnetic filters. These compact network connectors for heavy-duty applications are resistant to electromagnetic faults, and they are designated for use in compact RJ45 applications compliant with 10/100 or 10/100/1000 Base-T (gigabit) Ethernet.

LISTED UNDER: Packaging & Interconnects
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Protective Caps Seal Threaded Connectors

September 26, 2007 6:41 am | Product Releases | Comments

Binder-USA announces it’s M8 protective caps that ensure a protection rating of IP67 when applied to unmated connectors. These caps are suitable for use in factory automation and process control applications. They feature a PA (polyamide) body, PUR (polyurethane) retaining strap and a nitrile rubber (NBR) seal.

LISTED UNDER: Packaging & Interconnects

Cordsets and Receptacles for Factory Automation Equipment

September 26, 2007 6:30 am | Product Releases | Comments

Turck, Inc. announces its 26 and 28-pin molded M27 multifast connectors that can be used to provide power and signals to factory automation equipment in the automotive, semiconductor and material handling industries. They are replacements for D-Sub (DB-25) style connectors in industrial settings where DB-25 connectors are limited to 30V and low current.

LISTED UNDER: Packaging & Interconnects

Miniature Aluminium Enclosures Offer Desirable EMC Protection

September 26, 2007 6:09 am | Product Releases | Comments

TEKO launched its MINITEKAL range of miniature aluminium enclosures. These versatile and robust housings have been designed for easy assembly of the electronics. The all-aluminium design allows good levels of EMC protection to be implemented. Typical applications will include small hand-held measurement devices, low power Radio equipment, power supplies, peripherals, monitoring systems and detection devices.

LISTED UNDER: Packaging & Interconnects

Enclosures Users Can Wear and Store

September 25, 2007 9:53 am | Product Releases | Comments

OKW introduced a new belt/wall clip accessory for its SOFT-CASE Series which allows the enclosures to be worn on a belt and then stored on a wall, or in a cabinet, after use. With this new accessory part, the enclosures can be used for mobile electronics that are worn by a series of users and then returned to a store area after a given period, for example data logging, inventory management, medical and wellness devices and guided tour systems.

LISTED UNDER: Packaging & Interconnects

Two-Conductor Connector Offers Set-and-Forget Wire Termination

September 20, 2007 5:07 am | Product Releases | Comments

WAGO Corporation’s added the 222-412 to its LEVER-NUTS 222 Series of compact connectors.  It is UL/CNL listed up to 600V/20A and can accommodate both solid and stranded conductors ranging in size from AWG #12-28 in the same unit. CAGE CLAMP termination technology a maximum temperature rating of 105°C and ensures that the connector will reliably meet the requirements for a wide range of applications. It protects users against electrical shocks and employs an integral test point for testing/trouble-shooting a circuit.

LISTED UNDER: Packaging & Interconnects

Miniature Aluminium Enclosures

August 30, 2007 8:22 am | Product Releases | Comments

TEKO launched their ‘MINITEKAL’ range of miniature aluminium enclosures. These versatile and robust housings have been designed for easy assembly of the electronics. The all aluminium design allows good levels of EMC protection to be implemented. Typical applications will include small hand-held measurement devices, low power Radio equipment, power supplies, peripherals, monitoring systems and detection devices.

LISTED UNDER: Packaging & Interconnects

.040” Diameter Headers

August 29, 2007 7:26 am | Product Releases | Comments

Mill-Max introduces SIP and STRIP male pin headers which feature sturdy .040" diameter leads and mate to the company’s standard SIP and STRIP female sockets. The double-row connector is offered standard in 8 (2 × 4) up to 100 (2 × 50) position configurations on .100" spacing. This pairing creates a high-current interconnect rated at 8A per position.  When mated, these connectors create a high force, stiff and rugged interconnection between two boards or modules which resists separation and walkout

LISTED UNDER: Packaging & Interconnects

CMOS Photonics-based 40G Optical Active Cable

August 29, 2007 7:08 am | Product Releases | Comments

Luxtera, Inc. introduced a 40 Gigabit optical active cable (OAC), Blazar, which is said to be the world’s first CMOS Photonics product. The cable combines the characteristics optical modules and copper cables to provide a high bandwidth interconnect. The target markets are high performance computing InfiniBand and 40G proprietary rack to rack interconnect applications. With support for quad data rate (QDR), Blazar’s 40G bandwidth and extended reach of up to 300m overcomes the speed and range barriers that have limited InfiniBand applications to small computer clusters.

LISTED UNDER: Packaging & Interconnects

EMI Shielded Vents and Filters

August 29, 2007 6:55 am | Product Releases | Comments

Tech-Etch, Inc. introduced EMI shielded honeycomb vents, fan vents, quiet vents and air filters in all shapes and sizes. Honeycomb vents are offered in both standard and custom configurations. Nine different aluminum vent styles are offered, and additional shielding gaskets can be added to increase attenuation

LISTED UNDER: Packaging & Interconnects

SPDIP Mating Pin Headers

August 29, 2007 6:51 am | Product Releases | Comments

Mill-Max introduces its family of SPDIP mating pin headers to compliment its line of SPDIP sockets. SPDIP (shrink plastic) packaging reduces device lead spacing between pins down to .070" pitch (1.778 mm) which is useful in memory, microcontrollers, video controllers and automotive design applications.

LISTED UNDER: Packaging & Interconnects

PTFE-Based Coreless Semiconductor Package

August 29, 2007 6:32 am | Product Releases | Comments

Endicott Interconnect Technologies’ HyperBGA PTFE-based coreless semiconductor package enables silicon devices to run at high speeds. The combination of the low loss, low dielectric constant material and strip line cross sections enables signal speeds surpassing 12 Gb/s. The material compliance of the PTFE, combined with the dimensional stability of a copper-invar-copper center plane

LISTED UNDER: Packaging & Interconnects

Quick Connect Plugs

August 29, 2007 6:26 am | Product Releases | Comments

Phoenix Contact releases its QC (Quick Connect) 1.5 plugs, an insulation displacement connection (IDC)-based plug for use in an expanded range of wire gauges. They offer flexibility in wire selections (24 AWG to 16 AWG), they are designed on a 5 mm pitch (centerline) spacing and they come with or without mounting flanges. The plugs mate with proprietary 5 mm headers, enabling vertical, horizontal or lengthwise PCB mounting for wider range flexibility.

LISTED UNDER: Packaging & Interconnects

Vibration-Damping Breadboards for OEM Applications

August 29, 2007 6:22 am | Product Releases | Comments

Kinetic Systems introduces high-performance breadboards that provide a flat, stable surface for a variety of applications that include mounting or assembling lasers, small optical systems, prototyping and precise inspections. Available in four standard configurations, these breadboards feature high natural frequency, nominal broadband damping, and flatness of ±0.004" over a 24" × 24" area.

LISTED UNDER: Packaging & Interconnects

Shielding Gaskets Made from Recyclable Copper

August 29, 2007 6:17 am | Product Releases | Comments

Laird Technologies announces that 31 fingerstock standard products made from Recyclable Clean Copper (RCC) that offer similar performance characteristics to beryllium copper (BeCu) products, and they will work in 80 percent of all applications where BeCu is now used. RCC products do not contain beryllium, giving customers who want to avoid the use of beryllium containing metals a choice in alloy selections

LISTED UNDER: Packaging & Interconnects

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