Enclosures Use IP65 End Panels

July 11, 2008 6:57 am | Product Releases | Comments

Operating with IP65 die-cast aluminum end panels, Hammond Manufacturing’s 1457 Series enclosures have availability with or without integral flanges with sealing using o-ring screw seals and closed cell polyethylene sealing gaskets. The devices are designed to house PCBs mounted horizontally into internal

LISTED UNDER: Packaging & Interconnects

Room Temperature Curing Epoxy Applies Without Sagging, Dripping

July 7, 2008 12:26 pm | Product Releases | Comments

Master Bond’s Supreme 11AOHT two-component room temperature curing epoxy adhesive offer high thermal conductivity and desirable electrical insulation properties. The paste can be applied without sagging or dripping even on vertical surfaces, and it has a mixing ratio of 1 to 1 by weight or volume. Supreme 11AOHT has a service

LISTED UNDER: Packaging & Interconnects

Socket Features POP Memory

July 2, 2008 11:18 am | Ironwood Electronics, Inc. | Product Releases | Comments

Including a 12-mm2 POP memory on top with a pitch of 0.500 mm and 23 × 23 array, Ironwood Electronic’s SG-BGA-7116 0.400-mm BGA IC socket measures 12 mm2, has a pitch of 0.500 mm, and 28 × 28 ball array in a Samsung 12-mm2 168-ball fine pitch ball grid array package. The device operates at bandwidths up to 40 GHz with insertion loss less than 1 dB and contact resistance

LISTED UNDER: Packaging & Interconnects

Connectors Target Removable Storage Applications

July 2, 2008 9:44 am | Product Releases | Comments

Working well in removable storage applications, FCI’s iVDR (information versatile disk for removable usage) connector contributes to standardizing data platforms in media cartridges, internal port terminations, and auto-loading mechanisms in host applications. The hard-disk or solid-state device provides a single row of 26

LISTED UNDER: Packaging & Interconnects

Connector Supports Hard Disk Drives

June 30, 2008 12:49 pm | Product Releases | Comments

Supporting 1.8” form factor drives, FCI’s Micro serial ATA (SATA) plug connector have compatibility with applications such as notebook PCs, set-top boxes, game consoles, audio/video, and portable storage. The SATA-IO-standardized device meets SFF 2.6 specification with 16 positions (7 with a pitch for signal of 1.27 mm and 7+2 positions with a pitch for power of 1.27 mm). The RoHS-compliant

LISTED UNDER: Packaging & Interconnects

Enclosures Offer DIN-Rail or Cabinet Mounting

June 27, 2008 7:34 am | Product Releases | Comments

OKW Electronics’ CAMDEN DIN-Rail enclosures are designed for snap-in mounting on DIN EN 50/022/035/045 (TS 35/32/15) rails or direct cabinet mounting. The devices are appropriate for applications including automation, building and safety, sensors, relays, and signal distributors. The enclosures can be used as a subrack for interfaces, electronics modules, amplifiers, or transformers. The cases offer different connection options for commercial components, such as terminals, PCB plug headers, or front connectors

LISTED UNDER: Packaging & Interconnects

Interconnect Offers Obsolescence Solutions

June 18, 2008 7:44 am | Product Releases | Comments

Enabling footprint conversion adapters and offering obsolescence solutions, Interconnect Systems' FlexFrame, is a system of interconnects that offers flexible in configurations options including pin location and pitch, various standoff heights, and windows in the carrier that allow

LISTED UNDER: Packaging & Interconnects

Terminal Blocks minimize space and maximize connection

June 18, 2008 5:11 am | Product Releases | Comments

Providing space-saving connections for up to 10A the SPTA, an angled terminal block from Phoenix Contact, has push-in spring technology allowing solid and flexible wires with ferrules to be connected without the use of tools.  The terminal blocks provide

LISTED UNDER: Packaging & Interconnects

Boxes Feature Dual-Channel Gasket Construction

June 17, 2008 8:07 am | Product Releases | Comments

Featuring a dual-channel gasket, Bud Industries’ ANS Series die-cast NEMA boxes are made with a one-piece molded outer Silicone gasket and a wire-mesh with sponge rubber. The EMI/RFI-shielding devices meet NEMA 1, 2, 4, 4X, 12, 13, and IP65 ratings. The ADC-12 aluminum-alloy

LISTED UNDER: Packaging & Interconnects

Pin Connector Designed To Carry 20A Per Pin

June 17, 2008 6:41 am | Product Releases | Comments

Designed to carry 20A per pin, H11 DIN connectors from 2E Syscom, are available in standard 11-pin and half size five pin configurations. Female connectors are available with solder tail, spade terminal, screw-on terminal contacts, faston or screw terminations and

LISTED UNDER: Packaging & Interconnects

Power Terminal Block Splits High Power Inputs

June 17, 2008 6:15 am | Product Releases | Comments

Enabling users to split large gauge high power input into lower power, smaller gauge wire circuits, the Panel Power Distribution Terminal Block, Part OTP-80-03P, from BlockMaster Electronics is applicable for

LISTED UNDER: Packaging & Interconnects

Connector Groups Target MR Imaging Technology

June 16, 2008 12:43 pm | Product Releases | Comments

Focusing on MR Imaging technology, Johnson’s MMCX non-magnetic RF connectors provide a snap-on coupling design that are suitable for flex and array coils in MRI equipment for appendages. The Type-Ndevices are made from high purity copper alloys and deliver

LISTED UNDER: Packaging & Interconnects

Connector Performs at High Temperatures

June 16, 2008 6:01 am | Product Releases | Comments

Performing at temperatures from -40°C to +175°C, Cinch Connectors’ Dura-Con Micro-D connector family has an insulator in tooled sizes in 9-15-25-50-100-120 positions and a seven-point twist-pin design. The interconnects in these devices can handle over 50 G of shock (Mil-Std 1344, Method 2004, Condition E) and 20 G of vibration (Mil-Std 1344, Method 2005, Condition IV). The connectors are appropriate

LISTED UNDER: Packaging & Interconnects

Solderless Contact Switch Survives 3,000 Cycles

June 13, 2008 9:57 am | Product Releases | Comments

With a life cycle of 3,000 operations, ITT Interconnect Solutions' Universal Contact stamped contact uses pre-loading and anti-lift designs and comes with dome contact points and “side wings”. Addressing solderless component interconnection applications

LISTED UNDER: Packaging & Interconnects

Drum Heaters Include Thermostat

June 11, 2008 9:51 am | Product Releases | Comments

Giving off even heat to the contents within, Omega Engineering’s DRUM-DHW-55 Series of OMEGALUX drum heaters wrap around a 55-gallon drum and have a built in thermostat calibrated from 10 to 218°C. The spring-and-hook devices are resistant to mechanical damage and attack from many chemical substances. The drum heaters have a built-in electrically electrically-grounded metal screen and

LISTED UNDER: Packaging & Interconnects


You may login with either your assigned username or your e-mail address.
The password field is case sensitive.