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“Mini” USB Interconnects with Data Transfer Speeds up to 480 Mbps

February 1, 2008 9:20 am | Product Releases | Comments

Keystone Electronics Corp. is offering a series of advanced, miniaturized, high speed USB plug and socket interconnects which accommodate accelerated wideband applications for computer and electronic devices. With data transfer speeds up to 480 Mbps, these universal serial bus connectors interface with peripherals at three- to five-times the speed of parallel types plus 20- to 40-times faster than serial port connections for

LISTED UNDER: Packaging & Interconnects

Rail Guides Enable Precise Linear Positioning

January 28, 2008 10:33 am | Product Releases | Comments

SKF profile rail guides provide precise positioning, smooth operation, high load-carrying capacity, high stiffness, and unlimited stroke for linear motion system applications in including medical, factory automation, assembly, and electronics manufacturing and other markets. The expanded product line encompasses a variety of sizes featuring various slide configurations (normal, wide, long) and lengths to meet specific application requirements.

LISTED UNDER: Packaging & Interconnects

Metal Finishes Protect Air Filter Performance

January 14, 2008 8:31 am | Product Releases | Comments

Universal Air Filter's metal finish help increase air filter performance in harsh environments. These chrome-free, RoHS-compliant finishes are applied to the filter’s metallic components – frames, Uni-grid support, brackets, and honeycomb, to prevent corrosion as required by military and defense applications in MIL-C-5541 Class 1A and/or Class 3 compliance. Clear and yellow chemical conversion coatings are also important for EMI shielding

LISTED UNDER: Packaging & Interconnects
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Bus Couplers and Expansion Module Added to I/O Product Line

January 9, 2008 9:30 am | Product Releases | Comments

Phoenix Contact announced three additions to its Inline Modular family of products: two bus couplers and a backplane expansion module. The Modbus TCP/UDP bus coupler offers the same functionality as the company's Inline Modular Ethernet Bus Coupler in a compact form. The new product incorporates

LISTED UNDER: Packaging & Interconnects

Large Enclosures Enhance Visual Impact

January 9, 2008 6:50 am | Product Releases | Comments

OKW have extended their ‘SOFT-CASE’ enclosures with the ‘XL’ series. These models have been designed for larger mobile electronics. Typical applications will include hand-held instrumentation, medical devices, mobile data logging and data capture equipment. The enclosures have been designed to enhance the visual impact and tactile quality of modern electronic devices.

LISTED UNDER: Packaging & Interconnects

Single and Double Row Socket Interconnects

January 8, 2008 9:06 am | Product Releases | Comments

Mill-Max introduced its versatile socket interconnects for .025" pin diameter and .025" square pins in both single and double rows. These receptacles are precision-machined from brass alloy and assembled with proprietary six-finger contact clips that accept mated pin ranges from

LISTED UNDER: Packaging & Interconnects

Reduced Space High Density Filtered D-Sub Connector

January 8, 2008 9:00 am | Product Releases | Comments

Cinch Connectors introduced its RoHS-compliant high-density filtered D-Sub connector for the commercial market. The connector features a more dense contact arrangement, resulting in space and weight savings for design engineers. Compared to the equivalent standard density D-Sub connectors, the company claims a savings of 40 percent in space and over 100 percent in weight. Using high quality turned pin contacts

LISTED UNDER: Packaging & Interconnects

Low Profile Board Connectors for Portable Electronics(2)

January 8, 2008 8:50 am | Product Releases | Comments

Kycon expanded its micro board-to-board series to include the K050D Series 0.50 mm (0.020") pitch version. The series features a low profile board stacking height for use in portable electronics applications such as digital cameras, mobile phones and MP3 players.

LISTED UNDER: Packaging & Interconnects
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Circular Connector Operates in Harsh Applications

January 8, 2008 8:35 am | Product Releases | Comments

Amphenol Industrial introduced its over-molded Amphe-Armor Series that features durability and water tight construction to withstand harsh environments and demanding applications. The field-installable, field-repairable series comes in a variety of shell sizes and contacts with either a PT or a GT insert option. It is suitable for many applications including geophysical, machine tool, railway and motor control environments

LISTED UNDER: Packaging & Interconnects

Hand-Held Enclosures Feature Soft Edge Grips

January 8, 2008 8:27 am | Product Releases | Comments

Teko Enclosures extended the range of its TEKNET ABS enclosures with the B2 models that have larger battery compartments to accept four 1.5V AA cells or two 9V cells. Typical applications include in-field test and measurement instruments, medical devices and data loggers. These ergonomic hand-held enclosures feature soft-touch edge grips for secure and comfortable holding during use. The edge grips also provide protection for the case moldings. The standard case material is off-white or black ABS

LISTED UNDER: Packaging & Interconnects

Protective Vent Maximizes Airflow in Portable Devices

January 8, 2008 7:10 am | Product Releases | Comments

W. L. Gore & Associates, Inc. added its 3 mm-high airflow vent to its line of GORE Protective Vents. As the smallest protective vent in the line of insert-molded vents, the D3 vent relieves pressure that builds inside the housing. This vent prevents premature failure of the housing seals by virtually eliminating the vacuum, or by managing pressure fluctuations caused by pressure build-up. It provides continuous airflow

LISTED UNDER: Packaging & Interconnects

RoHS-Compliant Connector Features Extended Life Cycle

January 8, 2008 6:59 am | Product Releases | Comments

C&K Components enhanced its CCM01 and CCM02 smart card connectors with increased protection against PIN number theft. While fully complying with VISA PCI PED requirements, the additional protection eliminates the capability for a hacker to insert a bug on the connector and extract the PIN details. Used in point-of-sale (PoS or transaction) applications, these connectors are housed in compact

LISTED UNDER: Packaging & Interconnects

Pi Filter Connector for Military/Avionics Applications

January 8, 2008 6:54 am | Product Releases | Comments

ITT Electronic Components announced its TMDMP filter, a Micro-D connector with desirable attenuation. Its internal filter design provides the density needed to accommodate the ferrite tubes necessary for Pi filtering in military and aerospace applications. Compatible with MIL-DTL-83513, the filter connector is suitable for integrated avionics and electronic warfare, satellites and space systems, radar and sensors

LISTED UNDER: Packaging & Interconnects

Segment Protectors Provide Single Location for the Terminator

January 7, 2008 10:27 am | Product Releases | Comments

Pepperl+Fuchs introduced its R2 FieldConnex Segment Protectors. This product family allows the segment protector to be disconnected while leaving trunk communications uninterrupted, and they inherently prevent over-termination that can cause start-up and commission problems. They are also designed to eliminate errors that can occur while

LISTED UNDER: Packaging & Interconnects

Connectors Meet AdvancedTCA Specifications

January 4, 2008 11:28 am | Product Releases | Comments

Molex Incorporated introduced its 170-circuit AdvancedMC connector solution for 12.5 Gbps NRZ signal transmission. The connectors support PIGMG AdvancedTCA industry specifications for next-generation mezzanine cards and are well-suited for a wide range of applications in the telecommunications, computing and IEEE 1386 markets, as well as non-ATCA applications.

LISTED UNDER: Packaging & Interconnects

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