Connector Strips and Blocks Ease Line Integration

August 7, 2008 9:26 am | Product Releases | Comments

Enabling the connection of additional wires without cutting the main conductor, OKW Electronics’ CISB Series isolated connection strips and blocks offer cable capacities from 14 to 10 AWG in the smallest blocks and from 3/0 AWG to 300 MCM in the largest size. The four smallest sizes (up to 2 AWG) come in 12-pole strips and the five largest

LISTED UNDER: Packaging & Interconnects

Connector Series Designed For Correct Alignment

August 5, 2008 6:34 am | Avx Corporation | Product Releases | Comments

From AVX, The 6288 Series of secure lock zero insertion force (ZIF) connectors features a shaped cable construction for correct alignment.  The connector’s one-touch flip lock provides “click” feedback, eliminates production process failures, and prevents

LISTED UNDER: Packaging & Interconnects

Adhesives Target Personal Communication Devices

July 30, 2008 7:02 am | Product Releases | Comments

Having electrical conductivity appropriate for personal communications devices, Adhesives Research’s ARclad 92262 and ARclad 92264 acrylic adhesives perform in applications such as mobile phones, computers, PDAs, disk drives, modems and automotive electronics. The 1.800-mil (0.045-mm) ARclad 92262

LISTED UNDER: Packaging & Interconnects

Low-Chlorine Content Resin Targets Halogen-free Products

July 28, 2008 10:33 am | Product Releases | Comments

Ticona Engineering Polymers announced a new grade of Fortron PPS that reduces the amount of chlorine contained in the formulation, thereby enabling electrical and electronic component original equipment manufacturers and their suppliers to design and make products that will comply with

LISTED UNDER: Packaging & Interconnects

Enclosures Target Handheld Electronics

July 25, 2008 8:11 am | Product Releases | Comments

Having designs dedicated to desktop and handheld electronics, TEKO Enclosures’ TEKBOX range of keypad enclosures are appropriate for applications such as data entry keypad devices for point-of-sale, test and measurement, medical and computer equipment. The 3.70" × 6.30” × 1.43” TEKBOX-SLANT and 6.30” × 3.70” × 1.43” TEKBOX-SLOPE include sloping front keypads, contacts for

LISTED UNDER: Packaging & Interconnects

Connector System Uses a Microsite

July 24, 2008 10:15 am | Product Releases | Comments

Utilizing a dedicated microsite, FCI’s HCI Power Distribution Connector System has contacts that accommodate over 82 A based on a 30°C temperature rise with zero airflow. The modularly-tooled design contains a molded-in guidance

LISTED UNDER: Packaging & Interconnects

Test Points Accommodate PCBs

July 22, 2008 1:10 pm | Product Releases | Comments

Targeting 0.062” thick mountable PCBs, Components Corporation’s TP-104, TP-105, and TP-106 Series of color-coded test points are made of phosphor #510 alloy and 100% matte tin over nickel underplate with a 15% glass-filled polyester collar. The loop-style TP-104 Series and oval-loop style TP-106 Series have 0.063” mounting holes, are precut to any of 30 positions, and offered on breakaway strips with 0.125” centers. The TP-105

LISTED UNDER: Packaging & Interconnects

Plug-In Cards Offer Broad Support For Switching

July 22, 2008 8:57 am | Keithley Instruments | Product Releases | Comments

Offering broader support for switching configurations the Model 3724 Dual 1X30 Solid State FET Relay Multiplexer Card and the Model 3750 Multifunction I/O card from Keithley Instruments, are the addition of plug-in cards for the Series 3700 System Switch/Multimeter and

LISTED UNDER: Packaging & Interconnects

Male Connectors Simulate Females

July 18, 2008 8:15 am | Product Releases | Comments

Using designs to simulate 0.062” (1.580-mm) thick daughtercards, Sullins Connector Solution’s male edgecard connector series come with phosphor bronze gold-plated contact fingers that are standardized with 10 or 30 µ” overall gold over 50µ” nickel. Tail options for the RoHS-compliant devices include 100 µ” pure tin or 5 µ” gold in lengths ranging from 0.100” (2.54 mm) to 0.560” (14.220 mm) with

LISTED UNDER: Packaging & Interconnects

IDCs Target High Voltage Inverters

July 17, 2008 4:47 am | Avx Corporation | Product Releases | Comments

Targeting high voltage inverters in the lighting industry and other industrial equipment, AVX’s 9177 Series of insulated displacement connectors (IDCs) handle up to 15 A at a rating of up to 650 V. The end-stackable devices have availability as a single contact, two-way and three-way configurations with 14 to 20 AWG inserted into the contact slot using mass termination tools. The phosphor bronze contact

LISTED UNDER: Packaging & Interconnects

Enclosures Use IP65 End Panels

July 11, 2008 6:57 am | Product Releases | Comments

Operating with IP65 die-cast aluminum end panels, Hammond Manufacturing’s 1457 Series enclosures have availability with or without integral flanges with sealing using o-ring screw seals and closed cell polyethylene sealing gaskets. The devices are designed to house PCBs mounted horizontally into internal

LISTED UNDER: Packaging & Interconnects

Room Temperature Curing Epoxy Applies Without Sagging, Dripping

July 7, 2008 12:26 pm | Product Releases | Comments

Master Bond’s Supreme 11AOHT two-component room temperature curing epoxy adhesive offer high thermal conductivity and desirable electrical insulation properties. The paste can be applied without sagging or dripping even on vertical surfaces, and it has a mixing ratio of 1 to 1 by weight or volume. Supreme 11AOHT has a service

LISTED UNDER: Packaging & Interconnects

Socket Features POP Memory

July 2, 2008 11:18 am | Ironwood Electronics, Inc. | Product Releases | Comments

Including a 12-mm2 POP memory on top with a pitch of 0.500 mm and 23 × 23 array, Ironwood Electronic’s SG-BGA-7116 0.400-mm BGA IC socket measures 12 mm2, has a pitch of 0.500 mm, and 28 × 28 ball array in a Samsung 12-mm2 168-ball fine pitch ball grid array package. The device operates at bandwidths up to 40 GHz with insertion loss less than 1 dB and contact resistance

LISTED UNDER: Packaging & Interconnects

Connectors Target Removable Storage Applications

July 2, 2008 9:44 am | Product Releases | Comments

Working well in removable storage applications, FCI’s iVDR (information versatile disk for removable usage) connector contributes to standardizing data platforms in media cartridges, internal port terminations, and auto-loading mechanisms in host applications. The hard-disk or solid-state device provides a single row of 26

LISTED UNDER: Packaging & Interconnects

Connector Supports Hard Disk Drives

June 30, 2008 12:49 pm | Product Releases | Comments

Supporting 1.8” form factor drives, FCI’s Micro serial ATA (SATA) plug connector have compatibility with applications such as notebook PCs, set-top boxes, game consoles, audio/video, and portable storage. The SATA-IO-standardized device meets SFF 2.6 specification with 16 positions (7 with a pitch for signal of 1.27 mm and 7+2 positions with a pitch for power of 1.27 mm). The RoHS-compliant

LISTED UNDER: Packaging & Interconnects


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