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ExpressCard-to-PXI Extension Kit Creates More PXI Slots

June 5, 2008 10:14 am | Product Releases | Comments

Consisting of the EC-8560 ExpressCard and PXI-8565 PXI card, the multi-slot ExpressCard-to-PXI extension system from ADLINK Technology provides additional PXI slots for a laptop via a shielded cable connection up to 23’ in length. PXI devices installed in the extension PXI do not

LISTED UNDER: Packaging & Interconnects

International-use Switchmode Adapter has Interchangeable Plugs

June 5, 2008 6:57 am | Product Releases | Comments

Ventronics' Series FRM 024 12W-24W switchmode power adapter meets CEC Regulations, Efficiency Level IV and has UL/CSA/CE approvals. The single-output devices have slide-on, interchangeable AC plugs for USA, EU, UK, and Australia. There are eight models available accepting from 90 to 264 VAC with outputs from 0.9 to 2.5 A at 3 to 27 VDC with features that include overload and short-circuit protection.

LISTED UNDER: Packaging & Interconnects

Push-Pull Plug Connectors Provide Protection

June 3, 2008 11:51 am | Product Releases | Comments

The new VARIOSUB Push-Pull plug connector system from Phoenix Contact has a plug-and-play positive locking system to provide IP67 protection.  Designed for Industrial Ethernet and PROFINET applications, the connector family enables transmission of data and power signals directly to local devices. The Push-Pull is available in three versions

LISTED UNDER: Packaging & Interconnects
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Sockets Suit 0.8 mm Pitch SDRAM

May 30, 2008 10:48 am | Ironwood Electronics, Inc. | Product Releases | Comments

Ironwood Electronics recently introduced a high performance BGA socket for 0.8 mm pitch SDRAM. The SG-BGA-6252 socket is designed for a 9 mm × 11 mm, 0.8 mm pitch 60-pin BGA package and SG-BGA-6253 socket is designed for a 9 mm × 13 mm, 0.8 mm pitch 84-pin BGA package. The sockets operate at

LISTED UNDER: Packaging & Interconnects

Solder Cup Interconnects Terminate Discrete Wires

May 30, 2008 10:15 am | Product Releases | Comments

Mill-Max offers a method to terminate discrete wires into a pluggable interconnect with its Solder Cup Headers and mating Socket Connectors. They provide a pluggable path between wired applications. Manufactured using precision-machined brass alloy and beryllium copper contact clips, then assembled in

LISTED UNDER: Packaging & Interconnects

PC/104 Connectors Suit Embedded PC Applications

May 23, 2008 6:10 am | Product Releases | Comments

Available with features such as a press-fit tail option to enable solder-free attachment, a PC/104-compatible range of bus connectors from Harwin for embedded PC applications come in stack-through and non stack-through versions. Configurations available include a 32 × 32 way part supporting 8-bit systems and

LISTED UNDER: Packaging & Interconnects

Interconnect Family Features Contacts to Reduce Broadside Coupling and Crosstalk

May 21, 2008 8:16 am | Product Releases | Comments

Samtec expanded its Board-to-Board and Cable-to-Board line featuring a rugged Edge Rate contact. These systems are designed for applications where signal integrity and durability are critical. The specially designed contacts are asserted to offer impedance matching, reduced broadside coupling and crosstalk, and high cycle life. Board level systems include the

LISTED UNDER: Packaging & Interconnects

Rugged Three-Row Connectors Offer Low Insertion Force

May 14, 2008 5:02 am | Product Releases | Comments

Offering up to 96 contacts, the Datamate M83 three-row connector from Harwin incorporates specially designed female contacts that require a mating force of only 0.2 to 1 N. The devices conform with BS 9525-F0033 and can incorporate mixed contact technologies including signal, power, and coax. Targeted at applications such as industrial control systems, head-up displays

LISTED UNDER: Packaging & Interconnects
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Peel Packaging Protects Integrated Circuits

May 13, 2008 11:15 am | Product Releases | Comments

Newark launched a innovative peel packaging solution designed to protect fragile integrated circuits (ICs) during shipping, storing, and handling. Currently, it is available for ICs with case sizes measuring 12 mm × 12 mm and 14 mm × 14 mm. The ICs are placed within protective  recyclable plastic cells, which are then

LISTED UNDER: Packaging & Interconnects

Epoxy Adhesive Serviceable at Cryogenic Temperatures

May 12, 2008 12:00 pm | Product Releases | Comments

Optically clear with a mixed viscosity of 400 cps, the EP29LPSP epoxy adhesive/sealant for cryogenic applications from Master Bond can withstand temperatures as low as 4K as well as cryogenic shocks (i.e. room temperature down to liquid helium temperatures in a 5-10 minute time period). With a mix ratio of 100 to 65 by weight, the epoxy cures at room temperatures

LISTED UNDER: Packaging & Interconnects

Metal-Shell Connector Suits Harsh Environments

May 12, 2008 8:55 am | Product Releases | Comments

Providing a high contact density in a rugged metal shell, the KPTC backshell connector from ITT Interconnect Solutions has an IP67 sealing rating and gold plated contacts to allow the connector to withstand harsh environments. The bayonet-mount connector is available with a shielded endbell and comes in configurations with size 16 or 20 contacts with a lifetime of at least 500 mating cycles.

LISTED UNDER: Packaging & Interconnects

PCIe Edgecard Connectors Feature 1.00 mm Contact Centers

May 8, 2008 8:20 am | Product Releases | Comments

Sullins Connector Solutions expanded its 1.00 mm edgecard connector offering to include a full series of PCI Express (PCIe) parts. Designed to conform to PCI-SIG specifications, the devices enable user upgrades and bandwidth support to implement PCIe technology for desktop PCs and server systems. Featuring

LISTED UNDER: Packaging & Interconnects

Stainless Steel D-Subminiature Connectors Offer Reliability and Corrosion Resistance

May 8, 2008 8:03 am | Product Releases | Comments

ITT Interconnect Solutions has developed a corrosion resistant variation of its D-subminiature connectors. The stainless steel D-sub shells meet stringent requirements for corrosion resistance under MIL-Spec "P" grade stainless steel, while also meeting JEDEC standards for RoHS compliance. The shells are

LISTED UNDER: Packaging & Interconnects

USB Null Modem Cable Eases Connectivity Between PCs

May 8, 2008 7:43 am | Product Releases | Comments

Future Technology Devices International Limited (FTDI) announced availability of its USB NMC-2.5m USB to USB Null modem cable. Using an approach that was established using legacy RS-232 serial COM ports when the PC industry was in its infancy, the USB NMC-2.5m offers a

LISTED UNDER: Packaging & Interconnects

BeO Insulator Sets Thermal Conductivity Benchmark

May 2, 2008 5:50 am | Product Releases | Comments

Providing insulation in high-power RF and microwave power transistor packages as well as electron devices such as inductive output tubes, the BW3250 beryllium oxide (BeO)material from Brush Ceramic Products delivers a thermal conductivity of greater than 325 W/mK at room temperature, an increase of over 15 percent from the 285 W/mK that was previously achievable.

LISTED UNDER: Packaging & Interconnects

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