BGA packages minimize size, weight, and power
November 27, 2012 3:46 pm | Product Releases | CommentsData Device Corporation (DDC) introduces Mil-Temp versions of its Micro-ACE TE and Total-ACE MIL-STD-1553 BGA packages for use in extended temperature applications. These versions are offered in addition to the standard temperature components and share the same dimensions and pinout configurations.
LISTED UNDER: Packaging & Interconnects
Cable assembly delivers up to 10Gb/s data rate
November 26, 2012 12:22 pm | Product Releases | CommentsFCI has developed the AirMax VS high-speed internal cable assembly that utilizes an innovative shield-less connector design to deliver excellent signal integrity (SI) performance and data rates of up to 10Gb/s. The advanced AirMax VS high-speed internal cable assembly design features an optimized air dielectric....
LISTED UNDER: Packaging & InterconnectsFeedthrough capacitors rated at 200A
November 20, 2012 9:36 am | Product Releases | CommentsFor high power EMI filtering applications, where high current ratings are required, Syfer Technology has announced the SLV range of DC and AC feedthrough capacitors rated at 200A. This complements the extension to the existing SLG range rated at 100A. Typical applications for both ranges are considered to be IT servers....
LISTED UNDER: Electromechanical/Mechanical Devices | Packaging & Interconnects
Connector provides 140 electrical connections per inch
November 16, 2012 2:58 pm | Product Releases | CommentsFujipoly’s Zebra 2004 Elastomeric Connector provides 140 electrical connections per inch when positioned between a circuit board and a parallel electronic device such as an LCD display. This unique construction makes the connector ideal for devices with contact spacing as low as .020” (.50mm).
LISTED UNDER: Packaging & Interconnects | Readers Choice Tech Awards Winners
Single row, 1.27-mm pitch connector touts high current density
November 16, 2012 12:14 pm | Product Releases | CommentsERNI has developed an ultra compact 1.27-mm pitch single row connector system that delivers the highest current density on the market, according to the company. The MiniBridge wire-to-board connector features a high-temperature IDC wire termination and is
LISTED UNDER: Packaging & Interconnects | Readers Choice Tech Awards Winners
BGA socket operates at bandwidths up to 40 GHz with less than 1dB of insertion loss
November 14, 2012 10:33 am | Ironwood Electronics, Inc. | Product Releases | CommentsIronwood Electronics has recently introduced a new high performance BGA socket product line using unique elastomer capable of high speed, low inductance, high endurance and wide temperature applications. The SM-BGA-9019 socket is designed for 19x19 mm package size, 1mm pitch and operates at bandwidths up to 40 GHz with less than 1dB of insertion loss.
LISTED UNDER: Packaging & Interconnects
Environmentally sealed connector offers rugged design
November 8, 2012 4:07 pm | Product Releases | CommentsAnderson Power Products (APP) announces the expansion of the SPEC Pak family of environmentally sealed connectors, which now includes Mid-Power SPEC Pak. Mid-Power SPEC Pak, like the other connectors in the SPEC Pak family, is rugged and environmentally sealed (IP68) and leverages APP’s core Powerpole flat wiping contact technology.
LISTED UNDER: Packaging & Interconnects
Snap-in panel-mount recepticles off dip solder contacts
November 8, 2012 4:00 pm | Product Releases | CommentsBinder-USA has expanded the Series 720 snap-in panel-mount receptacles to now offer dip solder contacts. This addition provides more options for applications requiring a direct assembly to a printed circuit board. The snap-in connectors are ideally suited for commercial and medical applications because of their quick connect and disconnect feature.
LISTED UNDER: Packaging & Interconnects
Distribution blocks include multiple connection possibilities including 10-2AWG incoming and 14-4AWG outgoing
November 7, 2012 9:53 am | Product Releases | CommentsElectrotech Sales Group, LLC introduces compact distribution blocks (part numbers GDBD16 and GDBD35, 27.5mm wide and 46.5mm high) with multiple connection possibilities including 10-2AWG incoming and 14-4AWG outgoing. These blocks are designed for distribution of high current to feed multiple circuits.
LISTED UNDER: Packaging & Interconnects
Packaging technology allows for exceptional power dissapation
November 6, 2012 3:36 pm | Product Releases | CommentsAlpha and Omega Semiconductor Limited introduced its new Ground Exposed Die Pad Power IC platform, an innovative packaging technology capable of exceptional power dissipation. The high performance of this EZBuck™ dc/dc platform is attributed to a combination of IC design, low on-resistance MOSFET technology,
LISTED UNDER: Packaging & Interconnects
Pre-shaped adhesive designed for bonding diverse materials
November 5, 2012 10:50 am | Product Releases | CommentsMulti-Seals, Inc. has introduced an innovative alternative to liquid adhesives for component assembly. Multi-Seals F05 Poly-forms are flexible pre-shaped adhesives designed for bonding diverse materials, including metals, plastics, and glass. F05 has negligible vertical flow, which keeps the
LISTED UNDER: Packaging & Interconnects
Compact serial device server offers ease-of-use and flexibility for M2M connectivity
October 23, 2012 2:01 pm | Product Releases | CommentsLantronix announced the launch of its new xDirect device server -- a compact serial-to-Ethernet device server that provides quick and easy connectivity to virtually any device or machine with a serial interface. With plug-and-play simplicity and a small form factor, xDirect is suitable for a variety of markets from security to industrial automation to medical and more.
LISTED UNDER: Packaging & Interconnects
Starline EX and Amphe-EX series of connectors meet hazardous area classifications
October 19, 2012 9:33 am | News | CommentsAmphenol Industrial Global Operations has updated its third party approvals of the Starline EX and Amphe-EX series of connectors to meet hazardous area classifications and expands its support into new markets. These harsh environment connectors are ideal for use in the mining industry.
LISTED UNDER: Packaging & InterconnectsMOSFET packaging technology enables power designers to remove heat more effectively
October 18, 2012 9:18 am | Product Releases | CommentsAlpha and Omega Semiconductor Limited set a new standard in power density and technology innovation for discrete power MOSFETs with exposed-source XSFET, a new patent-pending packaging technology. XSFET incorporates the packaging technology where the bottom of the package is the “source”...
LISTED UNDER: Packaging & Interconnects
Pilot pins designed for positioning, alignment, pivot applications
October 15, 2012 3:33 pm | 3M Electronics Solutions Division | Product Releases | CommentsPEM self-clinching pilot pins offered in several variations provide ideal hardware solutions for positioning, alignment, or pivot applications. All install reliably in thin metal sheets and become permanent parts of an assembly. PEM Type TPS (300 Series stainless steel) pins install in steel or aluminum sheets and PEM Type TP4
LISTED UNDER: Packaging & Interconnects
