Cable assembly features shield-less design, delivers data rates of Up to 10Gb/s
December 10, 2012 3:10 pm | Fci | Product Releases | CommentsFCI has developed the AirMax VS® high-speed internal cable assembly that utilizes an innovative shield-less connector design to deliver excellent signal integrity (SI) performance and data rates of up to 10Gb/s. The advanced AirMax VS® high-speed internal cable assembly
LISTED UNDER: Cable
Stamped spring pin features 26 gram actuation force per ball and cycle life of 500,000 insertions
December 7, 2012 10:37 am | Product Releases | CommentsIronwood Electronics recently introduced a new BGA socket addressing high performance requirements for testing BGA devices - CBT-BGA-7010. The contactor is a stamped spring pin with 26 gram actuation force per ball and cycle life of 500,000 insertions. The self inductance of the contactor is 0.88 nH....
LISTED UNDER: Packaging & Interconnects
Connector systems enable 10-GBps speed
December 7, 2012 9:41 am | Product Releases | CommentsERNI has developed the MicroSpeed high-speed board-to-board connector system with a 1.0mm pitch. The MicroSpeed connector system is capable of speeds up to 10Gbps and is available in mezzanine, right angle and coplanar configurations. The open pin field design of the MicroSpeed connector can accommodate differential or single-ended signals....
LISTED UNDER: Packaging & Interconnects
Count On Tools debuts new accessories for StripFeeder Modular System
December 3, 2012 10:52 am | Product Releases | CommentsCount On Tools introduces additional accessories for its revolutionary StripFeeder System for loading tape-and-reel components onto compact modules for prototype and high-mix/low-volume applications. The StripFeeder .mod (Modular) System features removable rails that can be mounted to accommodate a wide array of tape sizes in the same feeder.
LISTED UNDER: Packaging & Interconnects | Packaging & Interconnects
MEMS variable capacitive accelerometers includes eight-pin connector
November 28, 2012 11:28 am | Product Releases | CommentsSilicon Designs has announced the global market launch of the model 2466 series. The 2466 series is a family of low-cost industrial grade triaxial universal MEMS capacitive accelerometer modules with eight-pin connector, designed to provide high-precision shock, vibration and acceleration measurements in three orthogonal directions across a broad range of applications.
LISTED UNDER: Boards & Modules | Packaging & Interconnects | Sensors & Actuators
BGA packages minimize size, weight, and power
November 27, 2012 3:46 pm | Product Releases | CommentsData Device Corporation (DDC) introduces Mil-Temp versions of its Micro-ACE TE and Total-ACE MIL-STD-1553 BGA packages for use in extended temperature applications. These versions are offered in addition to the standard temperature components and share the same dimensions and pinout configurations.
LISTED UNDER: Packaging & Interconnects
Cable assembly delivers up to 10Gb/s data rate
November 26, 2012 12:22 pm | Product Releases | CommentsFCI has developed the AirMax VS high-speed internal cable assembly that utilizes an innovative shield-less connector design to deliver excellent signal integrity (SI) performance and data rates of up to 10Gb/s. The advanced AirMax VS high-speed internal cable assembly design features an optimized air dielectric....
LISTED UNDER: Packaging & InterconnectsFeedthrough capacitors rated at 200A
November 20, 2012 9:36 am | Product Releases | CommentsFor high power EMI filtering applications, where high current ratings are required, Syfer Technology has announced the SLV range of DC and AC feedthrough capacitors rated at 200A. This complements the extension to the existing SLG range rated at 100A. Typical applications for both ranges are considered to be IT servers....
LISTED UNDER: Electromechanical/Mechanical Devices | Packaging & Interconnects
Connector provides 140 electrical connections per inch
November 16, 2012 2:58 pm | Product Releases | CommentsFujipoly’s Zebra 2004 Elastomeric Connector provides 140 electrical connections per inch when positioned between a circuit board and a parallel electronic device such as an LCD display. This unique construction makes the connector ideal for devices with contact spacing as low as .020” (.50mm).
LISTED UNDER: Packaging & Interconnects | Readers Choice Tech Awards Winners
Single row, 1.27-mm pitch connector touts high current density
November 16, 2012 12:14 pm | Product Releases | CommentsERNI has developed an ultra compact 1.27-mm pitch single row connector system that delivers the highest current density on the market, according to the company. The MiniBridge wire-to-board connector features a high-temperature IDC wire termination and is
LISTED UNDER: Packaging & Interconnects | Readers Choice Tech Awards Winners
BGA socket operates at bandwidths up to 40 GHz with less than 1dB of insertion loss
November 14, 2012 10:33 am | Ironwood Electronics, Inc. | Product Releases | CommentsIronwood Electronics has recently introduced a new high performance BGA socket product line using unique elastomer capable of high speed, low inductance, high endurance and wide temperature applications. The SM-BGA-9019 socket is designed for 19x19 mm package size, 1mm pitch and operates at bandwidths up to 40 GHz with less than 1dB of insertion loss.
LISTED UNDER: Packaging & Interconnects
Environmentally sealed connector offers rugged design
November 8, 2012 4:07 pm | Product Releases | CommentsAnderson Power Products (APP) announces the expansion of the SPEC Pak family of environmentally sealed connectors, which now includes Mid-Power SPEC Pak. Mid-Power SPEC Pak, like the other connectors in the SPEC Pak family, is rugged and environmentally sealed (IP68) and leverages APP’s core Powerpole flat wiping contact technology.
LISTED UNDER: Packaging & Interconnects
Snap-in panel-mount recepticles off dip solder contacts
November 8, 2012 4:00 pm | Product Releases | CommentsBinder-USA has expanded the Series 720 snap-in panel-mount receptacles to now offer dip solder contacts. This addition provides more options for applications requiring a direct assembly to a printed circuit board. The snap-in connectors are ideally suited for commercial and medical applications because of their quick connect and disconnect feature.
LISTED UNDER: Packaging & Interconnects
Distribution blocks include multiple connection possibilities including 10-2AWG incoming and 14-4AWG outgoing
November 7, 2012 9:53 am | Product Releases | CommentsElectrotech Sales Group, LLC introduces compact distribution blocks (part numbers GDBD16 and GDBD35, 27.5mm wide and 46.5mm high) with multiple connection possibilities including 10-2AWG incoming and 14-4AWG outgoing. These blocks are designed for distribution of high current to feed multiple circuits.
LISTED UNDER: Packaging & Interconnects
Packaging technology allows for exceptional power dissapation
November 6, 2012 3:36 pm | Product Releases | CommentsAlpha and Omega Semiconductor Limited introduced its new Ground Exposed Die Pad Power IC platform, an innovative packaging technology capable of exceptional power dissipation. The high performance of this EZBuck™ dc/dc platform is attributed to a combination of IC design, low on-resistance MOSFET technology,
LISTED UNDER: Packaging & Interconnects
