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Count On Tools debuts new accessories for StripFeeder Modular System

December 3, 2012 10:52 am | Product Releases | Comments

Count On Tools introduces additional accessories for its revolutionary StripFeeder System for loading tape-and-reel components onto compact modules for prototype and high-mix/low-volume applications. The StripFeeder .mod (Modular) System features removable rails that can be mounted to accommodate a wide array of tape sizes in the same feeder.

LISTED UNDER: Packaging & Interconnects | Packaging & Interconnects
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MEMS variable capacitive accelerometers includes eight-pin connector

November 28, 2012 11:28 am | Product Releases | Comments

Silicon Designs has announced the global market launch of the model 2466 series. The 2466 series is a family of low-cost industrial grade triaxial universal MEMS capacitive accelerometer modules with eight-pin connector, designed to provide high-precision shock, vibration and acceleration measurements in three orthogonal directions across a broad range of applications.

LISTED UNDER: Boards & Modules | Packaging & Interconnects | Sensors & Actuators

BGA packages minimize size, weight, and power

November 27, 2012 3:46 pm | Product Releases | Comments

Data Device Corporation (DDC) introduces Mil-Temp versions of its Micro-ACE TE and Total-ACE MIL-STD-1553 BGA packages for use in extended temperature applications. These versions are offered in addition to the standard temperature components and share the same dimensions and pinout configurations.

LISTED UNDER: Packaging & Interconnects

Cable assembly delivers up to 10Gb/s data rate

November 26, 2012 12:22 pm | Product Releases | Comments

FCI has developed the AirMax VS high-speed internal cable assembly that utilizes an innovative shield-less connector design to deliver excellent signal integrity (SI) performance and data rates of up to 10Gb/s. The advanced AirMax VS high-speed internal cable assembly design features an optimized air dielectric....

LISTED UNDER: Packaging & Interconnects

Feedthrough capacitors rated at 200A

November 20, 2012 9:36 am | Product Releases | Comments

For high power EMI filtering applications, where high current ratings are required, Syfer Technology has announced the SLV range of DC and AC feedthrough capacitors rated at 200A. This complements the extension to the existing SLG range rated at 100A. Typical applications for both ranges are considered to be IT servers....

LISTED UNDER: Electromechanical/Mechanical Devices | Packaging & Interconnects

Connector provides 140 electrical connections per inch

November 16, 2012 2:58 pm | Product Releases | Comments

Fujipoly’s Zebra 2004 Elastomeric Connector provides 140 electrical connections per inch when positioned between a circuit board and a parallel electronic device such as an LCD display. This unique construction makes the connector ideal for devices with contact spacing as low as .020” (.50mm).

LISTED UNDER: Packaging & Interconnects | Readers Choice Tech Awards Winners

Single row, 1.27-mm pitch connector touts high current density

November 16, 2012 12:14 pm | Product Releases | Comments

ERNI has developed an ultra compact 1.27-mm pitch single row connector system that delivers the highest current density on the market, according to the company. The MiniBridge wire-to-board connector features a high-temperature IDC wire termination and is

LISTED UNDER: Packaging & Interconnects | Readers Choice Tech Awards Winners

BGA socket operates at bandwidths up to 40 GHz with less than 1dB of insertion loss

November 14, 2012 10:33 am | Ironwood Electronics, Inc. | Product Releases | Comments

Ironwood Electronics has recently introduced a new high performance BGA socket product line using unique elastomer capable of high speed, low inductance, high endurance and wide temperature applications. The SM-BGA-9019 socket is designed for 19x19 mm package size, 1mm pitch and operates at bandwidths up to 40 GHz with less than 1dB of insertion loss.

LISTED UNDER: Packaging & Interconnects

Environmentally sealed connector offers rugged design

November 8, 2012 4:07 pm | Product Releases | Comments

Anderson Power Products (APP) announces the expansion of the SPEC Pak family of environmentally sealed connectors, which now includes Mid-Power SPEC Pak. Mid-Power SPEC Pak, like the other connectors in the SPEC Pak family, is rugged and environmentally sealed (IP68) and leverages APP’s core Powerpole flat wiping contact technology.

LISTED UNDER: Packaging & Interconnects

Snap-in panel-mount recepticles off dip solder contacts

November 8, 2012 4:00 pm | Product Releases | Comments

Binder-USA has expanded the Series 720 snap-in panel-mount receptacles to now offer dip solder contacts. This addition provides more options for applications requiring a direct assembly to a printed circuit board. The snap-in connectors are ideally suited for commercial and medical applications because of their quick connect and disconnect feature.

LISTED UNDER: Packaging & Interconnects

Distribution blocks include multiple connection possibilities including 10-2AWG incoming and 14-4AWG outgoing

November 7, 2012 9:53 am | Product Releases | Comments

Electrotech Sales Group, LLC introduces compact distribution blocks (part numbers GDBD16 and GDBD35, 27.5mm wide and 46.5mm high) with multiple connection possibilities including 10-2AWG incoming and 14-4AWG outgoing.  These blocks are designed for distribution of high current to feed multiple circuits.

LISTED UNDER: Packaging & Interconnects

Packaging technology allows for exceptional power dissapation

November 6, 2012 3:36 pm | Product Releases | Comments

Alpha and Omega Semiconductor Limited  introduced its new Ground Exposed Die Pad Power IC platform, an innovative packaging technology capable of exceptional power dissipation. The high performance of this EZBuck™ dc/dc platform is attributed to a combination of IC design, low on-resistance MOSFET technology,

LISTED UNDER: Packaging & Interconnects

Pre-shaped adhesive designed for bonding diverse materials

November 5, 2012 10:50 am | Product Releases | Comments

Multi-Seals, Inc. has introduced an innovative alternative to liquid adhesives for component assembly.  Multi-Seals F05 Poly-forms are flexible pre-shaped adhesives designed for bonding diverse materials, including metals, plastics, and glass.  F05 has negligible vertical flow, which keeps the

LISTED UNDER: Packaging & Interconnects

Compact serial device server offers ease-of-use and flexibility for M2M connectivity

October 23, 2012 2:01 pm | Product Releases | Comments

Lantronix announced the launch of its new xDirect device server -- a compact serial-to-Ethernet device server that provides quick and easy connectivity to virtually any device or machine with a serial interface. With plug-and-play simplicity and a small form factor, xDirect is suitable for a variety of markets from security to industrial automation to medical and more.

LISTED UNDER: Packaging & Interconnects

MOSFET packaging technology enables power designers to remove heat more effectively

October 18, 2012 9:18 am | Product Releases | Comments

Alpha and Omega Semiconductor Limited set a new standard in power density and technology innovation for discrete power MOSFETs with exposed-source XSFET, a new patent-pending packaging technology. XSFET incorporates the packaging technology where the bottom of the package is the “source”...

LISTED UNDER: Packaging & Interconnects

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